Method and apparatus for producing and preparing electronic components
LINDNER FRIEDRICH PAUL, BURGGRAF JUERGEN, WIMPLINGER MARKUS, UHRMANN THOMAS
Year of Publication 19.04.2024
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Year of Publication 19.04.2024
Patent
Method and substrate system for the separation of carrier substrates
UHRMANN, THOMAS, POVAZAY, BORIS, WIMPLINGER, MARKUS, BURGGRAF, JURGEN, THALLNER, BERNHARD
Year of Publication 16.02.2024
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Year of Publication 16.02.2024
Patent
PROCESS AND SUBSTRATE SYSTEM FOR SEPARATING CARRIER SUBSTRATES
POVAZAY, Boris, WIMPLINGER, Markus, THALLNER, Bernhard, UHRMANN, Thomas, BURGGRAF, Jürgen
Year of Publication 28.09.2023
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Year of Publication 28.09.2023
Patent
Method and device for producing and preparing electronic components
UHRMANN, THOMAS, LINDNER, FRIEDRICH PAUL, WIMPLINGER, MARKUS, BURGGRAF, JURGEN
Year of Publication 16.05.2023
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Year of Publication 16.05.2023
Patent
METHOD AND DEVICE FOR THE PRODUCTION AND PROVISION OF ELECTRONIC COMPONENTS
WIMPLINGER, Markus, LINDNER, Friedrich, UHRMANN, Thomas, BURGGRAF, Jürgen
Year of Publication 27.04.2023
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Year of Publication 27.04.2023
Patent
Importance of alignment control during permanent bonding and its impact on via-last alignment for high density 3D interconnects
De Vos, Joeri, Lan Peng, Phommahaxay, Alain, Van Ongeval, Joost, Miller, Andy, Beyne, Eric, Kurz, Florian, Wagenleiter, Thomas, Wimplinger, Markus, Uhrmann, Thomas
Published in 2016 IEEE International 3D Systems Integration Conference (3DIC) (01.11.2016)
Published in 2016 IEEE International 3D Systems Integration Conference (3DIC) (01.11.2016)
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Conference Proceeding
Temporary bonding on the move towards high volume: A status update on cost-of-ownership
Uhrmann, Thomas, Burggraf, Jurgen, Wiesbauer, Harald, Bravin, Julian, Matthias, Thorsten, Wimplinger, Markus, Lindner, Paul
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
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Conference Proceeding
Wafer edge defect study of temporary bonded and thin wafers in TSV process flow
Jie Gong, Sood, Sumant, Bhat, Rohit, Jahanbin, Sina, Aji, Prashant, Uhrmann, Thomas, Bravin, Julian, Burggraf, Jurgen, Wimplinger, Markus, Lindner, Paul
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding
Method and device for compensating deformation
SINNER DANIEL, LINDNER FRIEDRICH PAUL, BURGGRAF JUERGEN, WAGENLEITNER THOMAS, FINGER MICHAEL, ROLLINGER HERVE, WIMPLINGER MARKUS, UHRMANN THOMAS
Year of Publication 12.04.2024
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Year of Publication 12.04.2024
Patent
METHOD AND DEVICE FOR COMPENSATING DISTORTION
WIMPLINGER, Markus, LINDNER, Friedrich, UHRMANN, Thomas, WAGENLEITNER, Thomas, ROHRINGER, Harald, ZINNER, Dominik, FINGER, Martin, BURGGRAF, Jürgen
Year of Publication 11.05.2023
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Year of Publication 11.05.2023
Patent
Recent progress in thin wafer processing
Uhrmann, Thomas, Matthias, Thorsten, Wimplinger, Markus, Burggraf, Jurgen, Burgstaller, Daniel, Wiesbauer, Harald, Lindner, Paul
Published in 2013 IEEE International 3D Systems Integration Conference (3DIC) (01.10.2013)
Published in 2013 IEEE International 3D Systems Integration Conference (3DIC) (01.10.2013)
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Conference Proceeding