Die Attach Effect on Electrical Performance and Reliability of Embedded Die Package
Tang, Qingyuan, Dchar, Ilyas, Then, Nam Khong
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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Conference Proceeding
Surface mount semiconductor device and method of manufacture
Then, Nam Khong, Yandoc, Ricardo, Fan, Haibo, Ting, Kow Siew, Brown, Adam Richard, Tan, Wei Leong
Year of Publication 15.08.2023
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Year of Publication 15.08.2023
Patent
SURFACE MOUNT SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
Then, Nam Khong, Yandoc, Ricardo, Brown, Adam, Fan, Haibo, Ting, Kow Siew, Tan, Wei Leong
Year of Publication 03.04.2019
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Year of Publication 03.04.2019
Patent
Surface Mount Semiconductor Device and Method of Manufacture
THEN, Nam Khong, TING, Kow Siew, YANDOC, Ricardo, TAN, Wei Leong, BROWN, Adam Richard, FAN, Haibo
Year of Publication 28.02.2019
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Year of Publication 28.02.2019
Patent
Surface mount semiconductor device and method of manufacture
TAN WEI LEONG, FAN HAIBO, TING KOW SIEW, BROWN ADAM, THEN NAM KHONG, YANDOC RICARDO
Year of Publication 02.04.2019
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Year of Publication 02.04.2019
Patent