by HONDA, Susumu
Published in The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits (1997)

by KOBAYASHI, Tadashi
Published in The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits (1996)

by GAKU, Morio
Published in The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits (20.03.1998)

by ICHIMURA, Akira, MIKAMI, Osamu, UCHIDA, Teiji, YOSHIMURA, Ryoukou, HIKITA, Makoto
Published in The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits (20.03.1998)

by SASAKI, Jun
Published in The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits (20.03.1998)

by HONDA, Susumu
Published in The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits (20.03.1998)

by ASAI, Motoo
Published in The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits (20.03.1998)

by TSUKADA, Yutaka
Published in The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits (20.03.1998)

by TAKAHASHI, Toru
Published in The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits (20.03.1998)

by ARAI, Kunio
Published in The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits (20.03.1998)

by HATADA, Kenzo
Published in The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits (20.01.1998)

by SHIMADA, Osamu, HISANO, Katsumi, IWASAKI, Hideo, ISHIZUKA, Masaru, FUKUOKA, Yoshitaka
Published in The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits (20.01.1998)

by ITOH, Masataka
Published in The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits (20.01.1998)

by YOSHIDA, Ikuo, IMASU, Satoshi, HAYASHIDA, Tetsuya, TAKEURA, Shinobu, KURIHARA, Ryoichi
Published in The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits (20.11.1997)

by TSUKUI, Tsutomu
Published in The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits (20.11.1997)

by HIRANO, Yoshikazu
Published in The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits (20.11.1997)

by TSUJI, Shinji
Published in The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits (20.11.1997)

by KUSAKA, Toshiki, KIDO, Toshihiro
Published in The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits (20.11.1997)

by TSUKADA, Yutaka
Published in The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits (20.11.1997)

by YAMANAKA, Kimihiro, TSUKADA, Yutaka
Published in The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits (20.11.1997)