Challenges to via middle TSV integration at sub-28nm nodes
Kamineni, Himani Suhag, Kannan, Sukeshwar, Alapati, Ramakanth, Thangaraju, Sarasvathi, Smith, Daniel, Dingyou Zhang, Shan Gao
Published in IEEE International Interconnect Technology Conference (01.05.2014)
Published in IEEE International Interconnect Technology Conference (01.05.2014)
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Conference Proceeding
Thermal stability of copper Through-Silicon Via barriers during IC processing
Civale, Y., Croes, K., Miyamori, Y., Thangaraju, S., Redolfi, A., Van Ammel, A., Velenis, D., Cherman, V., Hendrickx, P., Van der Plas, G., Cockburn, A., Gravey, V., Kumar, N., Zhitao Cao, Tezcan, D. S., Soussan, P., Travaly, Y., Tokei, Z., Beyne, E., Swinnen, B.
Published in 2011 IEEE International Interconnect Technology Conference (01.05.2011)
Published in 2011 IEEE International Interconnect Technology Conference (01.05.2011)
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Conference Proceeding