On the thermal stability of physically-vapor-deposited diffusion barriers in 3D Through-Silicon Vias during IC processing
Civale, Yann, Croes, Kristof, Miyamori, Yuichi, Velenis, Dimitrios, Redolfi, Augusto, Thangaraju, Sarasvathi, Ammel, Annemie Van, Cherman, Vladimir, Plas, Geert Van der, Cockburn, Andrew, Gravey, Virginie, Kumar, Nirajan, Cao, Zhitao, Travaly, Youssef, Tőkei, Zsolt, Beyne, Eric, Swinnen, Bart
Published in Microelectronic engineering (01.06.2013)
Published in Microelectronic engineering (01.06.2013)
Get full text
Journal Article
Conference Proceeding
Integration of TSVs, wafer thinning and backside passivation on full 300mm CMOS wafers for 3D applications
Jourdain, A., Buisson, T., Phommahaxay, A., Redolfi, A., Thangaraju, S., Travaly, Y., Beyne, E., Swinnen, B.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Get full text
Conference Proceeding
BMD impact on silicon fin defect at TSV bottom
Zhang, Dingyou, Thangaraju, Sarasvathi, Smith, Daniel, Kamineni, Himani, Klewer, Christian, Scholefield, Mark, Lei, Ming, Vikram, Abhishek, Lim, Victor, Kim, Wonwoo, Alapati, Ramakanth
Published in Electronics letters (19.06.2014)
Published in Electronics letters (19.06.2014)
Get full text
Journal Article
Technology Assessment of Through-Silicon Via by Using [Formula Omitted]-[Formula Omitted] and [Formula Omitted]-[Formula Omitted] Measurements
Katti, Guruprasad, Stucchi, Michele, Velenis, Dimitrios, Thangaraju, Sarasvathi, De Meyer, Kristin, Dehaene, Wim, Beyne, Eric
Published in IEEE electron device letters (01.07.2011)
Published in IEEE electron device letters (01.07.2011)
Get full text
Journal Article
Technology Assessment of Through-Silicon Via by Using C- V and C- t Measurements
Katti, G., Stucchi, M., Velenis, D., Thangaraju, S., De Meyer, K., Dehaene, W., Beyne, E.
Published in IEEE electron device letters (01.07.2011)
Published in IEEE electron device letters (01.07.2011)
Get full text
Journal Article
Correlation study of white light interferometer measurements with atomic force microscope measurements for post-CMP dishing measurements applied to TSV processing
Fisher, Daniel W., Timoney, Padraig, Yeong-Uk Ko, Vaid, Alok, Thangaraju, Sarasvathi, Smith, Daniel, Sung Pyo Jung, Alapati, Ramakanth, Wonwoo Kim, Peak, Jonathan, Amin, Hemant, Johnson, Tim
Published in 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014) (01.05.2014)
Published in 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014) (01.05.2014)
Get full text
Conference Proceeding
New interferometric measurement technique for small diameter TSV
Timoney, Padraig, Fisher, Daniel, Yeong-Uk Ko, Vaid, Alok, Thangaraju, Sarasvathi, Smith, Daniel, Kamineni, Himani, Dingyou Zhang, Alapati, Ramakanth, Wonwoo Kim, Ke Xiao, Edmundson, Holly, Smith, Nigel, Peterson, Brennan, Amin, Hemant, Peak, Jonathan, Johnson, Tim
Published in 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014) (01.05.2014)
Published in 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014) (01.05.2014)
Get full text
Conference Proceeding
Novel stress-free Keep Out Zone process development for via middle TSV in 20nm planar CMOS technology
Rabie, Mohamed A., Premachandran, C. S., Ranjan, Rakesh, Natarajan, Mahadevan Iyer, Sing Fui Yap, Smith, Daniel, Thangaraju, Sarasvathi, Alapati, Ramakanth, Benistant, Francis
Published in IEEE International Interconnect Technology Conference (01.05.2014)
Published in IEEE International Interconnect Technology Conference (01.05.2014)
Get full text
Conference Proceeding
Wafer level high temperature reliability study by backside probing f or a 50um thin TSV wafer
Premachandran, C. S., Ranjan, Rakesh, Agarwal, Rahul, Yap Sing Fui, Paliwoda, Peter, Sarasvathi, Thangaraju, Arfa, Gondal, Patrick, Justison, Mahadeva Iyer, Natarajan
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Get full text
Conference Proceeding