Fabrication and Characterization of Polymer-Enhanced TSVs, Inductors, and Antennas for Mixed-Signal Silicon Interposer Platforms
Thadesar, Paragkumar A., Bakir, Muhannad S.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2016)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2016)
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Journal Article
Fabrication of Microsensor for Detection of Low-Concentration Formaldehyde Gas in Formalin-Treated Fish
Ghione, Giovanni, Xu, Nuo, Kuroda, Rihito, Alam, Syed M., Narayanan, Pritish, Thadesar, Paragkumar A., Phillips, Jamie, Conley, John F., Park, Jin-Seong, Graham, Samuel, Letizia, Rosa
Published in IEEE transactions on electron devices (01.12.2020)
Published in IEEE transactions on electron devices (01.12.2020)
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Journal Article
Low-Loss Air-Isolated Through-Silicon Vias for Silicon Interposers
Hanju Oh, Thadesar, Paragkumar A., May, Gary S., Bakir, Muhannad S.
Published in IEEE microwave and wireless components letters (01.03.2016)
Published in IEEE microwave and wireless components letters (01.03.2016)
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Journal Article
Novel photodefined polymer-embedded vias for silicon interposers
Thadesar, Paragkumar A, Bakir, Muhannad S
Published in Journal of micromechanics and microengineering (01.03.2013)
Published in Journal of micromechanics and microengineering (01.03.2013)
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Journal Article
Dimension and liner dependent thermomechanical strain characterization of through-silicon vias using synchrotron x-ray diffraction
Liu, Xi, Thadesar, Paragkumar A., Taylor, Christine L., Kunz, Martin, Tamura, Nobumichi, Bakir, Muhannad S., Sitaraman, Suresh K.
Published in Journal of applied physics (14.08.2013)
Published in Journal of applied physics (14.08.2013)
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Journal Article
Experimental Stress Characterization and Numerical Simulation for Copper Pumping Analysis of Through-Silicon Vias
Xi Liu, Thadesar, Paragkumar A., Taylor, Christine L., Kunz, Martin, Tamura, Nobumichi, Bakir, Muhannad S., Sitaraman, Suresh K.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2016)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2016)
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Journal Article
Endpoint Detection in Low Open Area TSV Fabrication Using Optical Emission Spectroscopy
Ja Myung Gu, Thadesar, Paragkumar A., Dembla, Ashish, Bakir, Muhannad S., May, Gary S., Sang Jeen Hong
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2014)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2014)
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Journal Article
Novel through-silicon via technologies for 3D system integration
Thadesar, Paragkumar A., Dembla, Ashish, Brown, Devin, Bakir, Muhannad S.
Published in 2013 IEEE International Interconnect Technology Conference - IITC (01.06.2013)
Published in 2013 IEEE International Interconnect Technology Conference - IITC (01.06.2013)
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Conference Proceeding
Novel photodefined polymer-clad through-silicon via technology integrated with endpoint detection using optical emission spectroscopy
Thadesar, Paragkumar A., Ja Myung Gu, Dembla, Ashish, Sang Jeen Hong, May, Gary S., Bakir, Muhannad S.
Published in ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference (01.05.2013)
Published in ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference (01.05.2013)
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Conference Proceeding
Fabrication and characterization of mixed-signal polymer-enhanced silicon interposer featuring photodefined coax TSVs and high-Q inductors
Thadesar, Paragkumar A., Bakir, Muhannad S.
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding
Electrical, optical and fluidic through-silicon vias for silicon interposer applications
Parekh, M. S., Thadesar, P. A., Bakir, M. S.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Endpoint detection using optical emission spectroscopy in TSV fabrication
Ja Myung Gu, Thadesar, Paragkumar A., Dembla, Ashish, Sang Jeen Hong, Bakir, Muhannad S., May, Gary S.
Published in 2013 IEEE International Interconnect Technology Conference - IITC (01.06.2013)
Published in 2013 IEEE International Interconnect Technology Conference - IITC (01.06.2013)
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Conference Proceeding
Die edge protection to eliminate die chipping
YUN, CHANGHAN HOBIE, PARK, NO-SUN, KIM, DANIEL DAEIK, VADHAVKAR, SAMEER SUNIL, THADESAR, PARAGKUMAR AJAYBHAI
Year of Publication 01.03.2024
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Year of Publication 01.03.2024
Patent
Package comprising substrate with coupling element for integrated devices
SURAJ PRAKASH, FNU, RAMAN, NIKHIL, LEE, JOHN JONG-HOON, CARRARA, FRANCESCO, SONG, PENG, THADESAR, PARAGKUMAR AJAYBHAI
Year of Publication 01.09.2023
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Year of Publication 01.09.2023
Patent