Fabrication of Microsensor for Detection of Low-Concentration Formaldehyde Gas in Formalin-Treated Fish
Ghione, Giovanni, Xu, Nuo, Kuroda, Rihito, Alam, Syed M., Narayanan, Pritish, Thadesar, Paragkumar A., Phillips, Jamie, Conley, John F., Park, Jin-Seong, Graham, Samuel, Letizia, Rosa
Published in IEEE transactions on electron devices (01.12.2020)
Published in IEEE transactions on electron devices (01.12.2020)
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Journal Article
Fabrication and Characterization of Polymer-Enhanced TSVs, Inductors, and Antennas for Mixed-Signal Silicon Interposer Platforms
Thadesar, Paragkumar A., Bakir, Muhannad S.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2016)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2016)
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Journal Article
Low-Loss Air-Isolated Through-Silicon Vias for Silicon Interposers
Hanju Oh, Thadesar, Paragkumar A., May, Gary S., Bakir, Muhannad S.
Published in IEEE microwave and wireless components letters (01.03.2016)
Published in IEEE microwave and wireless components letters (01.03.2016)
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Journal Article
Novel photodefined polymer-embedded vias for silicon interposers
Thadesar, Paragkumar A, Bakir, Muhannad S
Published in Journal of micromechanics and microengineering (01.03.2013)
Published in Journal of micromechanics and microengineering (01.03.2013)
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Journal Article
Experimental Stress Characterization and Numerical Simulation for Copper Pumping Analysis of Through-Silicon Vias
Xi Liu, Thadesar, Paragkumar A., Taylor, Christine L., Kunz, Martin, Tamura, Nobumichi, Bakir, Muhannad S., Sitaraman, Suresh K.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2016)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2016)
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Journal Article
Endpoint Detection in Low Open Area TSV Fabrication Using Optical Emission Spectroscopy
Ja Myung Gu, Thadesar, Paragkumar A., Dembla, Ashish, Bakir, Muhannad S., May, Gary S., Sang Jeen Hong
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2014)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2014)
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Journal Article
Dimension and liner dependent thermomechanical strain characterization of through-silicon vias using synchrotron x-ray diffraction
Liu, Xi, Thadesar, Paragkumar A., Taylor, Christine L., Kunz, Martin, Tamura, Nobumichi, Bakir, Muhannad S., Sitaraman, Suresh K.
Published in Journal of applied physics (14.08.2013)
Published in Journal of applied physics (14.08.2013)
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Journal Article
집적 수동 디바이스들
THADESAR PARAGKUMAR, PRAKASH VINAY, YUN CHANGHAN, KIM DANIEL, PARK NOSUN, VADHAVKAR SAMEER
Year of Publication 10.05.2024
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Year of Publication 10.05.2024
Patent
패키지 기판의 전도성 트레이스들에 수동 컴포넌트를결합하는 전도성 기둥들을 갖는 칩 모듈
YUN CHANGHAN HOBIE, THADESAR PARAGKUMAR AJAYBHAI, VADHAVKAR SAMEER SUNIL, KIM DANIEL DAEIK, PARK NOSUN
Year of Publication 05.10.2023
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Year of Publication 05.10.2023
Patent
핀 커패시터 설계에 의한 커패시턴스 미세 튜닝
YUN CHANGHAN HOBIE, THADESAR PARAGKUMAR AJAYBHAI, VADHAVKAR SAMEER SUNIL, PARK NOSUN, KIM DANIEL DAEIK
Year of Publication 08.09.2023
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Year of Publication 08.09.2023
Patent
필터용 캡으로서 구성된 집적 패시브 디바이스를 포함하는 패키지
YUN CHANGHAN HOBIE, THADESAR PARAGKUMAR AJAYBHAI, VADHAVKAR SAMEER SUNIL, PARK NOSUN, KIM DANIEL DAEIK
Year of Publication 24.04.2023
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Year of Publication 24.04.2023
Patent
곡면 안테나를 포함하는 디바이스, 패키지 및/또는 기판
YUN CHANGHAN HOBIE, THADESAR PARAGKUMAR AJAYBHAI, VADHAVKAR SAMEER SUNIL, KIM DANIEL DAEIK, PARK NOSUN
Year of Publication 21.04.2023
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Year of Publication 21.04.2023
Patent
Embedded cooling technologies for densely integrated electronic systems
Sarvey, Thomas E., Yang Zhang, Li Zheng, Thadesar, Paragkumar, Gutala, Ravi, Cheung, Colman, Rahman, Arifur, Bakir, Muhannad S.
Published in 2015 IEEE Custom Integrated Circuits Conference (CICC) (01.09.2015)
Published in 2015 IEEE Custom Integrated Circuits Conference (CICC) (01.09.2015)
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Conference Proceeding
Novel through-silicon via technologies for 3D system integration
Thadesar, Paragkumar A., Dembla, Ashish, Brown, Devin, Bakir, Muhannad S.
Published in 2013 IEEE International Interconnect Technology Conference - IITC (01.06.2013)
Published in 2013 IEEE International Interconnect Technology Conference - IITC (01.06.2013)
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Conference Proceeding
Novel photodefined polymer-clad through-silicon via technology integrated with endpoint detection using optical emission spectroscopy
Thadesar, Paragkumar A., Ja Myung Gu, Dembla, Ashish, Sang Jeen Hong, May, Gary S., Bakir, Muhannad S.
Published in ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference (01.05.2013)
Published in ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference (01.05.2013)
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Conference Proceeding