A low-cost uncooled infrared microbolometer detector in standard CMOS technology
Tezcan, D.S., Eminoglu, S., Akin, T.
Published in IEEE transactions on electron devices (01.02.2003)
Published in IEEE transactions on electron devices (01.02.2003)
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Journal Article
Diamond nanoprobes for electrical probing of nanoelectronics device structures
Hantschel, T., Clarysse, T., Ajaykumar, A., Seidel, F., Tsigkourakos, M., Nuytten, T., Paredis, K., Eyben, P., Majeed, B., Tezcan, D.S., Vandervorst, W.
Published in Microelectronic engineering (01.06.2014)
Published in Microelectronic engineering (01.06.2014)
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Journal Article
TiN scanning probes for electrical profiling of nanoelectronics device structures
Hantschel, T., Schulze, A., Celano, U., Moussa, A., Arstila, K., Eyben, P., Majeed, B., Tezcan, D.S., Werner, T., Vandervorst, W.
Published in Microelectronic engineering (01.09.2012)
Published in Microelectronic engineering (01.09.2012)
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Journal Article
Backside thinned CMOS imagers with high broadband quantum efficiency realised using new integration process
DE MUNCK, K, BOGAERTS, J, TEZCAN, D. S, DE MOOR, P, SEDKY, S, VAN HOOF, C
Published in Electronics letters (03.01.2008)
Published in Electronics letters (03.01.2008)
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Journal Article
Backside illuminated thinned CMOS image sensors for space imaging
Minoglou, K., De Munck, K., Tezcan, D.S., Van Hoof, C., De Moor, P., Bogaerts, J., Veltroni, I.F.
Published in 2008 IEEE Sensors (01.10.2008)
Published in 2008 IEEE Sensors (01.10.2008)
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Conference Proceeding
3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 μm pitch through-Si vias
Swinnen, B., Ruythooren, W., De Moor, P., Bogaerts, L., Carbonell, L., De Munck, K., Eyckens, B., Stoukatch, S., Tezcan, D.S., Tokei, Z., Vaes, J., Van Aelst, J., Beyne, E.
Published in 2006 International Electron Devices Meeting (01.12.2006)
Published in 2006 International Electron Devices Meeting (01.12.2006)
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Conference Proceeding
Scalable Through Silicon Via with polymer deep trench isolation for 3D wafer level packaging
Tezcan, D.S., Duval, F., Philipsen, H., Luhn, O., Soussan, P., Swinnen, B.
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding
Through-silicon via and die stacking technologies for microsystems-integration
Beyne, E., De Moor, P., Ruythooren, W., Labie, R., Jourdain, A., Tilmans, H., Tezcan, D.S., Soussan, P., Swinnen, B., Cartuyvels, R.
Published in 2008 IEEE International Electron Devices Meeting (01.12.2008)
Published in 2008 IEEE International Electron Devices Meeting (01.12.2008)
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Conference Proceeding
Sloped Through Wafer Vias for 3D Wafer Level Packaging
Tezcan, D.S., Nga Pham, Majeed, B., De Moor, P., Ruythooren, W., Baert, K.
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding
Parylene N as a dielectric material for through silicon vias
Majeed, B., Pham, N.P., Tezcan, D.S., Beyne, E.
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
3D Embedding and Interconnection of Ultra Thin (≪ 20 μm) Silicon Dies
Iker, F., Tezcan, D.S., Teixeira, R.C., Soussan, P., De Moor, P., Beyne, E., Baert, K.
Published in 2007 9th Electronics Packaging Technology Conference (01.12.2007)
Published in 2007 9th Electronics Packaging Technology Conference (01.12.2007)
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Conference Proceeding
Development of vertical and tapered via etch for 3D through wafer interconnect technology
Tezcan, D.S., De Munck, K., Pham, N., Luhn, O., Aarts, A., De Moor, P., Baert, K., Van Hoof, C.
Published in 2006 8th Electronics Packaging Technology Conference (01.12.2006)
Published in 2006 8th Electronics Packaging Technology Conference (01.12.2006)
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Conference Proceeding
Improved Liquid Phase Chromatography Separation using Sub-micron Micromachining Technology
Tezcan, D.S., Verbist, A., De Malsche, W., Vangelooven, J., Eghbali, H., Clicq, D., Desmet, G., De Moor, P.
Published in 2007 IEEE International Electron Devices Meeting (01.12.2007)
Published in 2007 IEEE International Electron Devices Meeting (01.12.2007)
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Conference Proceeding
Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping
Civale, Y., Tezcan, D.S., Philipsen, H.G.G., Jaenen, P., Agarwal, R., Duval, F., Soussan, P., Travaly, Y., Beyne, E.
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
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Conference Proceeding
Lithography for Patterning inside through-Si Vias
Pham, N.P., Tezcan, D.S., Majeed, B., De Moor, P., Baert, K., Swinnen, B., Ruythooren, W.
Published in 2007 9th Electronics Packaging Technology Conference (01.12.2007)
Published in 2007 9th Electronics Packaging Technology Conference (01.12.2007)
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Conference Proceeding