by Morrison, J.M., Tessier, T.G., Gu, B.
Published in Circuit world (01.04.1994)

by Morrison, J.M., Tessier, T.G., Gu, B.
Published in Circuit world (01.04.1994)

by Zhaozhi Li, Houston, P.N., Baldwin, D.F., Stout, E.A., Tessier, T.G., Evans, J.L.
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)

by Morrison, J.M., Tessier, T.G., Gu, B.
Published in Proceedings of the International Conference on Multichip Modules (1994)

by Tessier, T.G., Adema, G.M., Turlik, I.
Published in Proceedings., 39th Electronic Components Conference (1989)

by Tessier, T.G., Adams, B.
Published in Proceedings of the International Conference on Multichip Modules (1994)

by Tessier, T.G., Chandler, G.
Published in 1992 Proceedings 42nd Electronic Components & Technology Conference (1992)

by Tessier, T.G., Shin, W.S., Yuen, Y.K., Do, B.T., Kuan, F., Ling, J.
Published in IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003 (2003)

by Tessier, T.G., Hoffman, W.F., Chandler, G.
Published in 12th International Electronic Manufacturing Technology Symposium (1992)

by Tessier, T.G., Chandler, G.
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.02.1993)

by Tessier, T.G., Myszka, E.G.
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)

by Frye, D.C., Skinner, M.P., Heistand, R.H., Garrou, P.E., Tessier, T.G.
Published in Proceedings of the International Conference on Multichip Modules (1994)

by Strandjord, A.J.G., Garrou, P.E., Heistand, R.H., Tessier, T.G.
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01.05.1995)

by Tessier, T.G., Hoffman, W.F., Stafford, J.W.
Published in 1991 Proceedings 41st Electronic Components & Technology Conference (1991)

by Strandjord, A.J.G., Heistand, R.H., Bremmer, J.N., Garrou, P.E., Tessier, T.G.
Published in 1994 Proceedings. 44th Electronic Components and Technology Conference (1994)

by Berry, M.J., Tessier, T.G., Turlik, I., Adema, G.M., Burdeaux, D.C., Carr, J.N., Garrou, P.
Published in 40th Conference Proceedings on Electronic Components and Technology (1990)