by ANDERSON, I. E, FOLEY, J. C, COOK, B. A, HARRINGA, J, TERPSTRA, R. L, UNAL, O
Published in Journal of electronic materials (01.09.2001)

by ANDERSON, I. E, COOK, B. A, HARRINGA, J, TERPSTRA, R. L
Published in Journal of electronic materials (01.11.2002)

by COOK, B. A, ANDERSON, I. E, HARRINGA, J. L, TERPSTRA, R. L
Published in Journal of electronic materials (01.11.2002)

by ÜNAL, O, ANDERSON, I. E, HARRINGA, J. L, TERPSTRA, R. L, COOK, B. A, FOLEY, J. C
Published in Journal of electronic materials (01.09.2001)

by COOK, B. A, ANDERSON, I. E, HARRINGA, J. L, TERPSTRA, R. L, FOLEY, J. C, ÜNAL, Ö, LAABS, F. C
Published in Journal of electronic materials (01.09.2001)

by Anderson, I E, Cook, B A, Harringa, J L, Terpstra, R L
Published in JOM (1989) (01.06.2002)

by Anderson, I. E., Cook, B. A., Harringa, J. L., Terpstra, R. L.
Published in JOM (1989) (01.06.2002)

by Anderson, I E, Terpstra, R L
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (26.06.2000)

by Anderson, Iver E, Terpstra, Robert L
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (15.03.2002)