Novel High Reliability and Low Dk/Df Dielectric RDL Material for High Frequency 5G Applications
Hamada, Kaori, Sato, Toshiyuki, Teraki, Shin, Komatsu, Fumikazu, Yoshida, Masaki, Ikarashi, Hirotatsu, Patelka, Maciej, Ozaki, Hiroshi
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
Low Dk / Df Dielectric Material for 5G Applications
Ikarashi, Hirotatsu, Sato, Toshiyuki, Teraki, Shin, Yoshida, Masaki, Ozaki, Hiroshi
Published in 2022 International Conference on Electronics Packaging (ICEP) (11.05.2022)
Published in 2022 International Conference on Electronics Packaging (ICEP) (11.05.2022)
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Conference Proceeding
COPPER MEMBER
OBATA NAOKI, TERAKI SHIN, OKUBO MASARU, KOKAJI YOSHINOBU, SATO MAKIKO
Year of Publication 11.04.2023
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Year of Publication 11.04.2023
Patent