Mold compound optimization and certification for Cu wire leaded package
Teng Seng Kiong, Hian, S. T. S., Khan, N.
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
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Conference Proceeding
Center Gate Molding challenges and improvements for cavity down TBGA packages
Muniandy, K., Hian, S. T. S., Teng Seng Kiong
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
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Conference Proceeding
Mold compound selection study for CMOS90 176 lead LQFP 24×24mm package
Teng Seng Kiong, Ruzaini, I., Hian, S. T. S.
Published in 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2012)
Published in 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2012)
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Conference Proceeding
Package warpage challenges for LQFP 144 lead CMOS 90 device and it's impact to lead coplanarity
Teng Seng Kiong, Ruzaini, Ibrahim, Kesvakumar, Foong Chee Seng
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
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Conference Proceeding
Wire diameter and length effects on wire sweep performance of multi-tier copper and gold wire bonding in plastic ball grid array packages
Hian, Serene Teh Seoh, Foong Chee Seng, Teng Seng Kiong, Kalandar, N. K. O.
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
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Conference Proceeding
Lead frame with power bar for semiconductor device
TENG SENG KIONG, YAP JIA LIN, KALANDAR NAVAS KHAN ORATTI, SUHAIMI AHMAD TERMIZI, AU YIN KHENG, LOW BOON YEW
Year of Publication 13.01.2015
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Year of Publication 13.01.2015
Patent
LEAD FRAME AND SEMICONDUCTOR PACKAGE MANUFACTURED THEREWITH
POH ZI SONG, TENG SENG KIONG, IBRAHIM MOHD RUSLI, LYE MENG KONG, MUNIANDY KESYAKUMAR V.C, AU YIN KHENG
Year of Publication 25.08.2011
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Year of Publication 25.08.2011
Patent