Flip-Chip Integration of III-V Chips on Wafer for mmW Applications
Efimov, Alexander S., Zaycev, Alexey A., Kurochka, Alexander S., Temnov, Alexander M., Dudinov, Konstantin V., Emelianov, Artem M., Korolkova, Darya D., Rudina, Anastasia D., Ranzhin, Yuriy S.
Published in 2022 IEEE 8th All-Russian Microwave Conference (RMC) (23.11.2022)
Published in 2022 IEEE 8th All-Russian Microwave Conference (RMC) (23.11.2022)
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