Effects of Ag content on fracture resistance of Sn–Ag–Cu lead-free solders under high-strain rate conditions
Suh, Daewoong, Kim, Dong W., Liu, Pilin, Kim, Hyunchul, Weninger, Jessica A., Kumar, Chetan M., Prasad, Aparna, Grimsley, Brian W., Tejada, Hazel B.
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (01.07.2007)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (01.07.2007)
Get full text
Journal Article