by Teo, M., Mhaisalkar, S.G., Wong, E.H., Poi-Siong Teo, Wong, C.C., Kristine Ong, Chin Foo Goh, Lay Kuan Teh
Published in IEEE transactions on components and packaging technologies (01.03.2005)

by Yan, Qingfeng, Teh, Lay Kuan, Shao, Qi, Wong, C. C, Chiang, Yet-Ming
Published in Langmuir (04.03.2008)

by CHEONG YI HENG, TEH LAY KUAN, GRZEGORZ LISAK
Year of Publication 18.02.2022

by Koh, Yaw Koon, Teh, Lay Kuan, Wong, Chee Cheong
Published in Thin solid films (30.06.2008)

by LIMARGA, Andi M, WIDJAJA, Sujanto, TICK HON YIP, LAY KUAN TEH
Published in Surface & coatings technology (01.04.2002)

by LAY KUAN TEH, CHEE CHEONG WONG, MHAISALKAR, Subodh, ONG, Kristine, POI SIONG TEO, EE HUA WONG
Published in Journal of electronic materials (01.04.2004)

by Cheong, Yi Heng, Ge, Liya, Zhao, Nahong, Teh, Lay Kuan, Lisak, Grzegorz
Published in Journal of electroanalytical chemistry (Lausanne, Switzerland) (01.08.2020)

by Limarga, Andi M, Widjaja, Sujanto, Yip, Tick Hon, Teh, Lay Kuan
Published in Surface & coatings technology (2002)

by Teh, Lay Kuan, Zhao, Nahong
Year of Publication 09.05.2019

by ZHANG, Chi, TEH, Lay Kuan
Year of Publication 12.07.2018

by Teh, Lay Kuan, Zhang, Chi
Year of Publication 12.07.2018

by PALALE, Suresh, YAN, Yan, TEH, Lay Kuan
Year of Publication 15.03.2018

by PALALE, Suresh, YAN, Yan, TEH, Lay Kuan
Year of Publication 15.03.2018

by Teh, Lay Kuan, Yan, Yan, Palale, Suresh
Year of Publication 15.03.2018

by Teh, Lay Kuan, Yan, Yan, Palale, Suresh
Year of Publication 15.03.2018