Package characterization of UTAC's Grid Array package (GQFN) and performance comparison over standard laminate packages
Teh, Daniel Ting Lee, Tubillo, Carolyn Epino, Kyaw Ko Lwin, Gu Bin, Dimaano, Ang Choon Ghee Jim, Sirinorakul, Saravuth, Suthiwongsunthorn, Nathapong
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
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Conference Proceeding
Thermal, electrical, mechanical analysis and validation of new package TLA developed by UTAC
Kian Yeow Gan, Thammavet, P., Daniel, T. L. T., Ore, S. H., Tamil, J., Hunat, C., Yongbo Yang, Suthiwongsunthorn, N., Laihog, E., Wattanakaroon, W., Sirinorakul, S., Gu Bin, Ang Choon Ghee, Ting Siew Hong
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
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Conference Proceeding