PIPAC versus HIPEC: cisplatin spatial distribution and diffusion in a swine model
Davigo, Axel, Passot, Guillaume, Vassal, Olivia, Bost, Muriel, Tavernier, Clément, Decullier, Evelyne, Bakrin, Naoual, Alyami, Mohammad, Bonnet, Jeanne-Marie, Louzier, Vanessa, Paquet, Christian, Allaouchiche, Bernard, Glehen, Olivier, Kepenekian, Vahan
Published in International journal of hyperthermia (01.01.2020)
Published in International journal of hyperthermia (01.01.2020)
Get full text
Journal Article
An atomistic investigation of the composition dependence in SiGe alloys during Solid Phase Epitaxial Regrowth
Payet, Anthony, Sklénard, Benoît, Barbé, Jean-Charles, Batude, Perrine, Tavernier, Clément, Gergaud, Patrice, Martin-Bragado, Ignacio
Published in Acta materialia (01.03.2016)
Published in Acta materialia (01.03.2016)
Get full text
Journal Article
Qualification of bumping processes: Experimental and numerical investigations on mechanical stress and failure modes induced by shear test
Gallois-Garreignot, Sébastien, Benzima, Naceur, Benmussa, Etienne, Moutin, Caroline, Bouchard, Pierre-Olivier, Fiori, Vincent, Tavernier, Clément
Published in Microelectronics and reliability (01.05.2015)
Published in Microelectronics and reliability (01.05.2015)
Get full text
Journal Article
Numerical analysis of thermo-mechanical and mobility effects for 28 nm node and beyond: Comparison and design consequences over bumping technologies
FIORI, Vincent, EWUAME, Komi-Atchou, GALLOIS-GARREIGNOT, Sébastien, JAOUEN, Hervé, TAVERNIER, Clément
Published in Microelectronics and reliability (01.04.2014)
Published in Microelectronics and reliability (01.04.2014)
Get full text
Journal Article
An Efficient Nonlocal Hot Electron Model Accounting for Electron-Electron Scattering
Zaka, A., Palestri, P., Rafhay, Q., Clerc, R., Iellina, M., Rideau, D., Tavernier, C., Pananakakis, G., Jaouen, H., Selmi, L.
Published in IEEE transactions on electron devices (01.04.2012)
Published in IEEE transactions on electron devices (01.04.2012)
Get full text
Journal Article
Strain engineering for bumping over IPs: Numerical investigations of thermo-mechanical stress induced mobility variations for CMOS 32 nm and beyond
FIORI, Vincent, GALLOIS-GARREIGNOT, Sébastien, JAOUEN, Herve, TAVERNIER, Clément
Published in Microelectronics and reliability (01.02.2013)
Published in Microelectronics and reliability (01.02.2013)
Get full text
Journal Article
On the accuracy of current TCAD hot carrier injection models in nanoscale devices
Zaka, Alban, Rafhay, Quentin, Iellina, Matteo, Palestri, Pierpaolo, Clerc, Raphaël, Rideau, Denis, Garetto, Davide, Dornel, Erwan, Singer, Julien, Pananakakis, Georges, Tavernier, Clément, Jaouen, Hervé
Published in Solid-state electronics (01.12.2010)
Published in Solid-state electronics (01.12.2010)
Get full text
Journal Article
Pressurized intraperitoneal aerosol chemotherapy (PIPAC) might increase the risk of anastomotic leakage compared to HIPEC: an experimental study
Tavernier, Clément, Passot, Guillaume, Vassal, Oliva, Allaouchiche, Bernard, Decullier, Evelyne, Bakrin, Naoual, Alyami, Mohammad, Davigo, Axel, Bonnet, Jeanne-Marie, Louzier, Vanessa, Paquet, Christian, Glehen, Olivier, Kepenekian, Vahan
Published in Surgical endoscopy (01.07.2020)
Published in Surgical endoscopy (01.07.2020)
Get full text
Journal Article
Assessing Criteria for a Safe Early Discharge After Laparoscopic Colorectal Surgery
Tavernier, Clement, Flaris, Alexandros N, Passot, Guillaume, Glehen, Olivier, Kepenekian, Vahan, Cotte, Eddy
Published in JAMA surgery (01.01.2022)
Published in JAMA surgery (01.01.2022)
Get full text
Journal Article
Chip Package Interactions: Package effects on copper pillar bump induced BEoL delaminations & associated numerical developments
Gallois-Garreignot, Sebastien, Guojun Hu, Fiori, Vincent, Sorrieul, Marika, Moutin, Caroline, Tavernier, Clement
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Get full text
Conference Proceeding
Packaging induced stress effects investigations on 40nm CMOS technology node: Measurements and optimization of device shifts
Ewuame, Komi Atchou, Bouchard, Pierre-Olivier, Fiori, Vincent, Gallois-Garreignot, Sebastien, Inal, Karim, Tavernier, Clement
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Get full text
Conference Proceeding
Damage accumulation during cryogenic and room temperature implantations in strained SiGe alloys
Payet, Anthony, Luce, Flavia Piegas, Curfs, Caroline, Mathieu, Benoît, Sklénard, Benoît, Barbé, Jean-Charles, Batude, Perrine, Joblot, Sylvain, Tavernier, Clément, Colombeau, Benjamin, Guissi, Sofiene, Martin-Bragado, Ignacio, Gergaud, Patrice
Published in Materials science in semiconductor processing (01.02.2016)
Published in Materials science in semiconductor processing (01.02.2016)
Get full text
Journal Article
Experimental and numerical investigations on Cu/low-k interconnect reliability during copper pillar shear test
Sart, Clement, Gallois-Garreignot, Sebastien, Fiori, Vincent, Kermarrec, Olivier, Moutin, Caroline, Tavernier, Clement, Jaouen, Herve
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Get full text
Conference Proceeding
Thermal Effects of Silicon Thickness in 3-D ICs: Measurements and Simulations
Souare, Papa Momar, Fiori, Vincent, Farcy, Alexis, de Crecy, Francois, Ben Jamaa, Haykel, Borbely, Andras, Coudrain, Perceval, Colonna, Jean-Philippe, Gallois-Garreignot, Sebastien, Giraud, Bastien, Cheramy, Severine, Tavernier, Clement, Michailos, Jean
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2014)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2014)
Get full text
Journal Article
Single Event Upset and Multiple Cell Upset Modeling in Commercial Bulk 65-nm CMOS SRAMs and Flip-Flops
Uznanski, S, Gasiot, G, Roche, P, Tavernier, C, Autran, Jean-Luc
Published in IEEE transactions on nuclear science (01.08.2010)
Published in IEEE transactions on nuclear science (01.08.2010)
Get full text
Journal Article
Investigations of Thermomechanical Stress Induced by TSV-Middle (Through-Silicon via) in 3-D ICs by Means of CMOS Sensors and Finite-Element Method
Ewuame, Komi Atchou, Fiori, Vincent, Inal, Karim, Bouchard, Pierre-Olivier, Gallois-Garreignot, Sebastien, Lionti, Sylvain, Tavernier, Clement, Jaouen, Herve
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2015)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2015)
Get full text
Journal Article
Influence of device architecture on junction leakage in low-temperature process FDSOI MOSFETs: Selected extended papers from ULIS 2012 conference
SKLENARD, Benoit, BATUDE, Perrine, TAVERNIER, Clement, POIROUX, Thierry, RAFHAY, Quentin, MARTIN-BRAGADO, Ignacio, CUIQIN XU, PREVITALI, Bernard, COLOMBEAU, Benjamin, KHAJA, Fareen-Adeni, CRISTOLOVEANU, Sorin, RIVALLIN, Pierrette
Published in Solid-state electronics (2013)
Get full text
Published in Solid-state electronics (2013)
Journal Article
Atomistic investigation of the impact of stress during solid phase epitaxial regrowth
Sklenard, Benoit, Barbe, Jean-Charles, Batude, Perrine, Rivallin, Pierrette, Tavernier, Clement, Cristoloveanu, Sorin, Martin-Bragado, Ignacio
Published in Physica status solidi. C (01.01.2014)
Published in Physica status solidi. C (01.01.2014)
Get full text
Journal Article
Continuum simulation of solid phase epitaxial regrowth of amorphized silicon including most advanced physical interactions
Delalleau, Julien, Pakfar, Ardechir, Bazizi, El-Medhi, Simola, Roberto, Tavernier, Clement
Published in Physica status solidi. A, Applications and materials science (01.03.2011)
Published in Physica status solidi. A, Applications and materials science (01.03.2011)
Get full text
Journal Article