Thermal management analysis of high-power electronic modules using Cu bonded AlN substrates
Tatoh, N., Hirose, Y., Nagai, M., Sasaki, K., Tatsumi, N., Higaki, K., Nakata, H., Tomikawa, T.
Published in ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) (2000)
Published in ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) (2000)
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Conference Proceeding
A new type of package incorporating a thin AlN heater for planar lightwave circuit devices
Saito, I., Nagai, M., Hirose, Y., Tatoh, N., Seki, M., Saitou, M., Tomikawa, T., Yamanaka, S.
Published in 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) (2001)
Published in 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) (2001)
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Conference Proceeding