Fabrication and Characterization of InGaAs Zero Bias SBD and Detector with T-gate Anode
Daoyu, FAN, Bin, NIU, Xibang, ZHOU, Haodong, LIN, Gang, LIN, Tangshen, CHEN
Published in 2020 International Conference on Microwave and Millimeter Wave Technology (ICMMT) (20.09.2020)
Published in 2020 International Conference on Microwave and Millimeter Wave Technology (ICMMT) (20.09.2020)
Get full text
Conference Proceeding
220GHz on-wafer measurement based on TRL calibration method
Lu Haiyan, Cheng Wei, Zhou Zhijiang, Zhou Jianjun, Wang Yuan, Kong Yuechan, Chen Tangshen
Published in 2015 12th IEEE International Conference on Electronic Measurement & Instruments (ICEMI) (01.07.2015)
Published in 2015 12th IEEE International Conference on Electronic Measurement & Instruments (ICEMI) (01.07.2015)
Get full text
Conference Proceeding
A new on-wafer multiline thru-reflect-line (TRL) calibration standard design
Haiyan Lu, Zhijiang Zhou, Cheng Wei, Jianjun Zhou, Tangshen Chen, Chen Chen
Published in Proceedings of 2014 3rd Asia-Pacific Conference on Antennas and Propagation (01.07.2014)
Published in Proceedings of 2014 3rd Asia-Pacific Conference on Antennas and Propagation (01.07.2014)
Get full text
Conference Proceeding
On-wafer deembeedding techniques with application to HEMT devices characterization
Haiyan Lu, Weibo Wang, Jianjun Zhou, Tangshen Chen, Chen Chen
Published in 2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) (01.10.2014)
Published in 2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) (01.10.2014)
Get full text
Conference Proceeding
Modeling techniques for graphene field-effect transistors
Haiyan Lu, Yun Wu, Shuai Huo, Yuehang Xu, Yuechan Kong, Tangshen Chen
Published in 2015 IEEE International Conference on Communication Problem-Solving (ICCP) (01.10.2015)
Published in 2015 IEEE International Conference on Communication Problem-Solving (ICCP) (01.10.2015)
Get full text
Conference Proceeding
Heterogenous Integration of InP DHBT and Si CMOS by 30\mu\mathrm Pitch Au-In Microbumps
Wu, LiShu, Dai, JiaYun, Wei, Cheng, Kong, YueChan, Chen, TangShen, Zhang, Tong
Published in 2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (08.04.2021)
Published in 2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (08.04.2021)
Get full text
Conference Proceeding
L-Band 1000W Single-Chip Internally Matched GaN Amplifier
Zhong, Shichang, Yin, Xiaoxing, Chen, Tangshen, Huang, Dan
Published in 2019 IEEE MTT-S International Wireless Symposium (IWS) (01.05.2019)
Published in 2019 IEEE MTT-S International Wireless Symposium (IWS) (01.05.2019)
Get full text
Conference Proceeding
Low Temperature Fine Pitch Au-In Solid Liquid Inter Diffusion Bonding for Wafer Level Packaging
Dai, Jiayun, Wang, Fei, Xu, Lida, Zhao, Desheng, Han, Ping, Chen, Tangshen
Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01.08.2020)
Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01.08.2020)
Get full text
Conference Proceeding