Energy deviation study of BEMS at BEPCII
Zhang, J.Y., Cai, X., Mo, X.H., Fu, C.D., Tang, G.Y., Achasov, M.N., Muchnoi, N.Yu, Nikolaev, I.B., Harris, F.A.
Published in Nuclear physics. B (01.02.2019)
Published in Nuclear physics. B (01.02.2019)
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Journal Article
Effects of dynamic electropulsing on microstructure and elongation of a Zn–Al alloy
Zhu, Y.H., To, S., Lee, W.B., Liu, X.M., Jiang, Y.B., Tang, G.Y.
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (15.02.2009)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (15.02.2009)
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Journal Article
Evaluation of MR spectroscopy and diffusion-weighted MRI in detecting bone marrow changes in postmenopausal women with osteoporosis
Tang, G.Y, Lv, Z.W, Tang, R.B, Liu, Y, Peng, Y.F, Li, W, Cheng, Y.S
Published in Clinical radiology (01.05.2010)
Published in Clinical radiology (01.05.2010)
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Journal Article
Effect of electropulse on solid solution treatment of 6061 aluminum alloy
Zheng, Y.S., Tang, G.Y., Kuang, J., Zheng, X.P.
Published in Journal of alloys and compounds (05.12.2014)
Published in Journal of alloys and compounds (05.12.2014)
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Journal Article
Analysis of the frequency dependence characteristics of wave attenuation and velocity dispersion using a poroelastic model with mesoscopic and microscopic heterogeneities
He, Y.‐X., Wang, S.X., Sun, C., Tang, G.Y., Zhu, W.
Published in Geophysical Prospecting (01.07.2021)
Published in Geophysical Prospecting (01.07.2021)
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Journal Article
Properties, microstructure and texture evolution of cold rolled Cu strips under electropulsing treatment
Zhu, R.F., Liu, J.N., Tang, G.Y., Shi, S.Q., Fu, M.W.
Published in Journal of alloys and compounds (15.12.2012)
Published in Journal of alloys and compounds (15.12.2012)
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Journal Article
A toy Monte Carlo simulation for the transverse polarization of high-energy electron beams
Chen, S.H., Huang, Y.S., Chen, Y., Duan, Z., Lou, X.C., Lan, X.F., Ruan, M.Q., Si, M.Y., Tang, G.Y., Wang, Y.W., Wang, P.C., Zhang, J.Y.
Published in Journal of instrumentation (01.08.2022)
Published in Journal of instrumentation (01.08.2022)
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Journal Article
The improved superelasticity of NiTi alloy via electropulsing treatment for minutes
Zhu, R.F., Liu, J.N, Tang, G.Y., Shi, S.Q., Fu, M.W., TSE, Zion Tsz Ho
Published in Journal of alloys and compounds (25.01.2014)
Published in Journal of alloys and compounds (25.01.2014)
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Journal Article
Microstructure evolution of copper strips with gradient temperature in electropulsing treatment
Zhu, R.F., Tang, G.Y., Shi, S.Q., Fu, M.W.
Published in Journal of alloys and compounds (25.12.2013)
Published in Journal of alloys and compounds (25.12.2013)
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Journal Article
Ectopic expression of peanut acyl carrier protein in tobacco alters fatty acid composition in the leaf and resistance to cold stress
Tang, G.Y., Ministry of Agriculture, Jinan (China). High-Tech Research Center, Wei, L.Q., Shandong Normal Univ., Jinan (China). Life Sciences Coll, Liu, Z.J., Ministry of Agriculture, Jinan (China). High-Tech Research Center, Bi, Y.P., Ministry of Agriculture, Jinan (China). High-Tech Research Center, Shan, L., Ministry of Agriculture, Jinan (China). High-Tech Research Center
Published in Biologia plantarum (01.09.2012)
Published in Biologia plantarum (01.09.2012)
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Journal Article
Experimental studies of the formation process and morphologies of carbon nanotubes with bamboo mode structures
Wang, Y.Y., Tang, G.Y., Koeck, F.A.M., Brown, Billyde, Garguilo, J.M., Nemanich, R.J.
Published in Diamond and related materials (01.04.2004)
Published in Diamond and related materials (01.04.2004)
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Journal Article
Conference Proceeding
Numerical simulation of Joule heating effect on sample band transport in capillary electrophoresis
Tang, G.Y., Yang, C., Gong, H.Q., Chai, J.C., Lam, Y.C.
Published in Analytica chimica acta (02.03.2006)
Published in Analytica chimica acta (02.03.2006)
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Journal Article
Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package
Zhang, X., Chai, T.C., Lau, J.H., Selvanayagam, C.S., Biswas, K., Shiguo Liu, Pinjala, D., Tang, G.Y., Ong, Y.Y., Vempati, S.R., Wai, E., Li, H.Y., Liao, E.B., Ranganathan, N., Kripesh, V., Jiangyan Sun, Doricko, J., Vath, C.J.
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding