Characterization of adhesively bonded joints using acousto-ultrasonics: Department of Mechanical Engineering, Ottawa University, Ontario (Canada), N89-12925, 229 pp. (Apr. 1988)
Tanary, S.
Published in NDT & E international : independent nondestructive testing and evaluation (1992)
Published in NDT & E international : independent nondestructive testing and evaluation (1992)
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Journal Article
Acousto-ultrasonic evaluation of adhesive joints: International advances in nondestructive testing. Edited by W.J. McGonnagle. Vol. 15, pp. 231–253. Gordon and Breach (1990)
Fahr, A., Tanary, S.
Published in NDT & E international : independent nondestructive testing and evaluation (1992)
Published in NDT & E international : independent nondestructive testing and evaluation (1992)
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Journal Article
Nondestructive evaluation of adhesively-bonded joints
Fahr, A., Tanary, S.
Published in NDT & E international : independent nondestructive testing and evaluation (1992)
Published in NDT & E international : independent nondestructive testing and evaluation (1992)
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Journal Article
Acousto-ultrasonic evaluation of adhesive joints
Fahr, A., Tanary, S.
Published in NDT & E international : independent nondestructive testing and evaluation (1992)
Published in NDT & E international : independent nondestructive testing and evaluation (1992)
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Journal Article
Nondestructive evaluation of adhesively-bonded joints: Impact of emerging NDE-NDI methods on aircraft design, manufacture and maintenance, Brussels (Belgium), 1–6 Oct. 1989. pp. 7-1 – 7-10 AGARD conference proceedings no. 462 (1990). ISBN 92 835 05468
Fahr, A., Tanary, S.
Published in NDT & E international : independent nondestructive testing and evaluation (1992)
Published in NDT & E international : independent nondestructive testing and evaluation (1992)
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Journal Article
Development of 3-D silicon die stacked package using flip chip technology with micro bump interconnects
Vempati, S.R., Su, N., Chee Houe Khong, Ying Ying Lim, Vaidyanathan, K., Lau, J.H., Liew, B.P., Au, K.Y., Tanary, S., Fenner, A., Erich, R., Milla, J.
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding
Acousto-ultrasonics for adhesive bond evaluation
Fahr, A., Youssef, Y., Roy, C., Tanary, S.
Published in NDT & E international : independent nondestructive testing and evaluation (1992)
Published in NDT & E international : independent nondestructive testing and evaluation (1992)
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Journal Article
Acousto-ultrasonics for adhesive bond evaluation: National Research Council of Canada, Ottawa, Ontario (Canada), N92-12289/4/GAR, 17 pp. (Sep. 1990)
Fahr, A., Youssef, Y., Roy, C., Tanary, S.
Published in NDT & E international : independent nondestructive testing and evaluation (1992)
Published in NDT & E international : independent nondestructive testing and evaluation (1992)
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Journal Article
Thermal Performance Enhancement for CSP Packages
Retuta, D., Ma, Y.Y., Kanth, R., Tan Hien Boon, Sun, A., Tanary, S.
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding
Better Tooling Design and Effective Parameter Optimization for Successful transfer MUF of Flip Chips packages
Kanth, K.R., Paghasian, K.Y., Retuta, D., Toh, C.H., Tanary, S., Tan Hian Boon
Published in 2007 9th Electronics Packaging Technology Conference (01.12.2007)
Published in 2007 9th Electronics Packaging Technology Conference (01.12.2007)
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Conference Proceeding
Thermally enhanced semiconductor package and method of producing the same
TANARY, SUSANTO, KOLAN, RAVI KANTH, LOW, TSE HOONG PATRICK, TAN, HIEN BOON, SUN, YI SHENG ANTHONY, RETUTA, DANNY VALLEJO
Year of Publication 01.05.2013
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Year of Publication 01.05.2013
Patent
Stacked die packages
TANARY, SUSANTO, WANG, CHUEN KHIANG, MEHTA, GAURAV, TAN, HIEN BOON, CHEONG, MARY ANNIE, SUN, ANTHONY YI SHENG
Year of Publication 21.10.2012
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Year of Publication 21.10.2012
Patent
Cavity chip package
KIM, SEONG KWANG BRANDON, TANARY, SUSANTO, IKSAN, HENRY, TAN, HIEN BOON, SUN, YI SHENG ANTHONY
Year of Publication 21.04.2011
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Year of Publication 21.04.2011
Patent
Cavity chip package
TANARY, SUSANTO, SUN, YI-SHENG ANTHONY, IKSAN, HENRY, TAN, HIEN-BOON, KIM, SEONG-KWANG BRANDON
Year of Publication 01.06.2007
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Year of Publication 01.06.2007
Patent
Stacked die packages
TANARY, SUSANTO, WANG, CHUEN KHIANG, MEHTA, GAURAV, SUN, ANTHONY YI-SHENG, TAN, HIEN BOON, CHEONG, MARY ANNIE
Year of Publication 16.07.2008
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Year of Publication 16.07.2008
Patent
Thermally enhanced semiconductor package and method of producing the same
TANARY, SUSANTO, KOLAN, RAVI KANTH, LOW, TSE HOONG PATRICK, SUN, YI-SHENG ANTHONY, TAN, HIEN-BOON, RETUTA, DANNY VALLEJO
Year of Publication 16.10.2007
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Year of Publication 16.10.2007
Patent