Challenges in copper 2nd bond quality on nickel palladium leadframe
Tan Kian Heong, Harun, Fuaida
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
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Conference Proceeding
Pad bending improvement on copper wire bonding on NiP/Pd/Au bond pad
Tan Kian Heong, Teo Chen Kim, Wang Mei Yong
Published in 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2012)
Published in 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2012)
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Conference Proceeding
Pd coated Cu wire bond on XoAA material in LQFP package
Wang Mei Yong, Teo, J., Gan Swee Lee, Tan Kian Heong, Swee, A.
Published in 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2012)
Published in 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2012)
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Conference Proceeding
Assembly for handling a semiconductor die and method of handling a semiconductor die
Tan, Kian Heong, Tong, Soon Hock, Oliveros Sumagpoa, Avelino, Lee, Kuang Ming, Paramio Joves, Ronald, Vergara Bicomong, Nestor, Kunamani, Thanabal Ganesh, Krishnan, Jagen
Year of Publication 09.10.2018
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Year of Publication 09.10.2018
Patent
BAUGRUPPE ZUM HANDHABEN EINES HALBLEITERCHIPS UND VERFAHREN ZUM HANDHABEN EINES HALBLEITERCHIPS
LEE, KUANG MING, OLIVEROS SUMAGPOA, AVELINO, VERGARA BICOMONG, NESTOR, KRISHNAN, JAGEN, KUNAMANI, THANABAL GANESH, TONG, SOON HOCK, PARAMIO JOVES, RONALD, TAN, KIAN HEONG
Year of Publication 18.02.2016
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Year of Publication 18.02.2016
Patent