The Comparison Study of Board Level Drop and Set Level Drop Performance
Zhang, Guosong, Wu, Minyan, Shang, Yunpeng, Zhou, Yonghua, Tan, Tingzuo
Published in 2024 25th International Conference on Electronic Packaging Technology (ICEPT) (07.08.2024)
Published in 2024 25th International Conference on Electronic Packaging Technology (ICEPT) (07.08.2024)
Get full text
Conference Proceeding
Three-point Bending Test Method Experimental Study for Package Strength and Crack Prediction through Finite Element Analysis
Wu, Minyan, Shang, Yunpeng, Tan, Tingzuo, Zhou, Yonghua
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
Get full text
Conference Proceeding
Underfill Affect Study on Chip Stress in Board & Set Level Drop Test
Wu, Minyan, Li, Xiaoqing, Tan, Tingzuo, Jiang, Song, Zhou, Yonghua
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
Get full text
Conference Proceeding