The process characterization of insulated Au-Flash PdCu for the challenging wire bonding applications
Siong Chin Teck, Eu Poh Leng, Tan Lan Chu, Zhang Xi, Loh Wan Yee, Su Dan, Tok Chee Wei
Published in 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference (01.09.2016)
Published in 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference (01.09.2016)
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Conference Proceeding
Insulated Au-Flash PdCu wire processing and wire bond process robustness improvements for TBGA & LQFP packages
Siong Chin Teck, Eu Poh Leng, Tan Lan Chu, Ibrahim, Mohd Rusli, Zhang Xi, Loh Wan Yee, Su Dan, Tok Chee Wei
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
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Conference Proceeding
Insulated PdCu wire bond challenges and resolution for HVM robustness
Siong Chin Teck, Eu Poh Leng, Tan Lan Chu, Ibrahim, Mohd Rusli, Au Ying Kheng, Yow Kai Yun, Zhang Xi, Lee, Cheryl, Su Dan, Tok Chee Wei, Murali, Sarangapani, Lyn, Robert
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
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Conference Proceeding
Challenges and resolution of insulated PdCu wire bond for TBGA HVM robustness
Siong Chin Teck, Eu Poh Leng, Tan Lan Chu, Ibrahim, Mohd Rusli, Au Ying Kheng, Zhang Xi, Lee, Cheryl, Su Dan, Tok Chee Wei, Murali, Sarangapani, Lyn, Robert
Published in 36th International Electronics Manufacturing Technology Conference (01.11.2014)
Published in 36th International Electronics Manufacturing Technology Conference (01.11.2014)
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Conference Proceeding
Circuit modules with front-side interposer terminals and through-module thermal dissipation structures
Low, Boon Yew, Tan, Lan Chu, Santos, Fernando A, Lim, Fui Yee, Li, Li
Year of Publication 14.02.2023
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Year of Publication 14.02.2023
Patent
Mold Compound and Copper Wire Selection for Quad-Flat Packages with High Density Leadframe in Automotive Applications
Tan, Vanessa Wyn Jean, Au, Yin Kheng, Low, Boon Yew, Eu, Poh Leng, Tan, Lan Chu
Published in 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) (01.09.2018)
Published in 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) (01.09.2018)
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Conference Proceeding
CIRCUIT MODULES WITH FRONT-SIDE INTERPOSER TERMINALS AND THROUGH-MODULE THERMAL DISSIPATION STRUCTURES
Low, Boon Yew, Tan, Lan Chu, Santos, Fernando A, Lim, Fui Yee, Li, Li
Year of Publication 06.07.2022
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Year of Publication 06.07.2022
Patent
CIRCUIT MODULES WITH FRONT-SIDE INTERPOSER TERMINALS AND THROUGH-MODULE THERMAL DISSIPATION STRUCTURES
Low, Boon Yew, Tan, Lan Chu, Santos, Fernando A, Lim, Fui Yee, Li, Li
Year of Publication 30.06.2022
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Year of Publication 30.06.2022
Patent
Semiconductor device with bond wire reinforcement structure
Low, Boon Yew, Lo, Wai Yew, Tan, Lan Chu, Eu, Poh Leng, Siong, Chin Teck
Year of Publication 06.07.2021
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Year of Publication 06.07.2021
Patent
SEMICONDUCTOR DEVICE WITH BOND WIRE REINFORCEMMENT STRUCTURE
Low, Boon Yew, Lo, Wai Yew, Tan, Lan Chu, Eu, Poh Leng, Siong, Chin Teck
Year of Publication 02.04.2020
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Year of Publication 02.04.2020
Patent
The exploration and characterization of insulated Au-Flash PdCu wire bonding applications
Teck, Siong Chin, Leng, Eu Poh, Chu, Tan Lan, Dan, Su, Wei, Tok Chee, Yee, Loh Wan, Zhangxi
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
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Conference Proceeding