450mm Cu single damascene BEOL process with 20nm half-pitched features
Sunoo Kim, Dunn, Shannon, Smith, Steven, Collision, WenLi, Prudhomme, Jamie, Huey-Ming Wang, Maniscalco, Joe, Yathapu, Nithin, Chulgi Song, Wang, Barry, Carr, Christopher, Hsi-Wen Liu, Gall, Bruce, Alaestante, Angelo, Min-Hui Chen, Conti, Richard, ChungJu Yang, Sullivan, Denis, Culafi, Kosta, Moon, BumKi, Yii-Cheng Lin, Yu-Lieh Fu, Sieg, Katherine, Larrea, Anne-Sophie, Fish, Norman, Swaine, Regina, Bialy, Alexander, Tallon, Milo, Stapf, Gerard, Hagwood, John, Bryant, Michael, Cottle, Rand, Chang, Stock, Kelling, Mark, Schaefer, Karsten, Franca, Dan, Pinyen Lin, Borst, Christopher, Kwangwook Lee, JongHeun Lim, Skilbred, David, Chien, Cc, Robertson, Frank, Fria, Erin
Published in 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) (01.05.2016)
Published in 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) (01.05.2016)
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