Electrochemical mechanical deposition (ECMD) technique for semiconductor interconnect applications
Başol, B.M, Uzoh, C.E, Talieh, H, Young, D, Lindquist, P, Wang, T, Cornejo, M
Published in Microelectronic engineering (01.10.2002)
Published in Microelectronic engineering (01.10.2002)
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Conference Proceeding
PLANAR COPPER PLATING AND ELECTROPOLISHING TECHNIQUES
BaŞol, B. M., Uzoh, C. E., Talieh, H., Wang, T., Guo, G., Erdemli, S., Cornejo, M., Bogart, J., Basol, E. C.
Published in Chemical engineering communications (01.07.2006)
Published in Chemical engineering communications (01.07.2006)
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Journal Article
Growth of CuInSe2 by two magnetron sputtering techniques
ROCKETT, A, LOMMASSON, T. C, CAMPOS, P, YANG, L. C, TALIEH, H
Published in Thin solid films (01.04.1989)
Published in Thin solid films (01.04.1989)
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Device-quality CuInSe2 produced by the hybrid process
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Journal Article
Growth of CuInSe 2 by two magnetron sputtering techniques
Rockett, A., Lommasson, T.C., Campos, P., Yang, L.C., Talieh, H.
Published in Thin solid films (1989)
Published in Thin solid films (1989)
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Journal Article
Sequential sputter deposition of titanium nitride and aluminum
Giboa, H., Mosely, R., Talieh, H., Guo, X.S.
Published in Seventh International IEEE Conference on VLSI Multilevel Interconnection (1990)
Published in Seventh International IEEE Conference on VLSI Multilevel Interconnection (1990)
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Conference Proceeding
Deposition of CuInSe/sub 2/ by the hybrid sputtering and evaporation method
Rockett, A., Agarwal, A., Yang, L.C., Banda, E., Kenshole, G., Kiely, C.J., Talieh, H.
Published in IEEE Conference on Photovoltaic Specialists (1990)
Published in IEEE Conference on Photovoltaic Specialists (1990)
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Conference Proceeding