Adsorption and Desorption of CO on W(110) Surfaces
Taek-seung Yang, Hae-geun Jee, 부진효, Hyun Seok Han, Gyung Hee Lee, Young Dok Kim, Soon-Bo Lee
Published in Bulletin of the Korean Chemical Society (20.06.2008)
Published in Bulletin of the Korean Chemical Society (20.06.2008)
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Journal Article
Effect of \hbox\hbox Plasma Doping on the Shallow Trench Isolation in CMOS Image Sensor Device
Pyo, Sung Gyu, Park, Ji Hwan, Yang, Taek-Seung
Published in IEEE electron device letters (01.11.2012)
Published in IEEE electron device letters (01.11.2012)
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Journal Article
Reduction process of dislocation and standby leakage current for embedded flash memory using nano-scale integration
Sun, Jong-Won, Park, Ji Hwan, Yang, Taek-Seung, Choi, Heesoo, Cui, Yinhua, Choi, Eunmi, Kim, Areum, Oh, Lee Seul, Lee, Sun Jae, Park, Hyunjin, Kim, Chang Hyun, Kim, Soo-Kil, Son, Hyungbin, Lee, Dong Hyun, Pyo, Sung Gyu
Published in Journal of nanoscience and nanotechnology (01.06.2013)
Published in Journal of nanoscience and nanotechnology (01.06.2013)
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Journal Article
Co-adsorption of CO and oxygen on W(110) surfaces
Yang, Taek-seung, Jee, Hae-geun, Boo, Jin-Hyo, Kim, Young Dok, Lee, Soon-Bo
Published in Vacuum (23.07.2010)
Published in Vacuum (23.07.2010)
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Journal Article
Size effect on electromigration reliability of pb-free flip chip solder bump
Jang-Hee Lee, Gi-Tae Lim, Young-Bae Park, Seung-Taek Yang, Min-Suk Suh, Qwan-Ho Chung, Kwang-Yoo Byun
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
Joule Heating Effect on the Electromigration Lifetimes and Failure Mechanisms of Sn-3.5Ag Solder Bump
Jang-Hee Lee, Yong-Duk Lee, Young-Bae Park, Seung-Taek Yang, Min-Suk Suh, Qwan-Ho Chung, Kwang-Yoo Byun
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding
An effective method to reduce residual lithium compounds on Ni-rich Li[Ni0.6Co0.2Mn0.2]O2 active material using a phosphoric acid derived Li3PO4 nanolayer
Jo, Chang-Heum, Cho, Dae-Hyun, Noh, Hyung-Joo, Yashiro, Hithshi, Sun, Yang-Kook, Myung, Seung Taek
Published in Nano research (04.12.2014)
Published in Nano research (04.12.2014)
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Journal Article
Intermetallic growth between Sn-Ag-(Cu) solder and Ni
Seung Taek Yang, Yoon Chung, Young-Ho Kim, Hong, B.H., Park, K.R., Song, H.G., Moris, J.W.
Published in Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) (2001)
Published in Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) (2001)
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Conference Proceeding