High-Density FinFET One-Time Programmable Memory Cell With Intra-Fin-Cell-Isolation Technology
Peng, Ping Chun, Chen, Yu-Zheng, Hsiao, Woan Yun, Chen, Kuang-Hsin, Lin, Ching-Pin, Tien, Bor-Zen, Chang, Tzong-Sheng, Lin, Chrong Jung, King, Ya-Chin
Published in IEEE electron device letters (01.10.2015)
Published in IEEE electron device letters (01.10.2015)
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Journal Article
A New High-Density Twin-Gate Isolation One-Time Programmable Memory Cell in Pure 28-nm CMOS Logic Process
Hsiao, Woan Yun, Peng, Ping Chun, Chang, Tzong-Sheng, Chih, Yu-Der, Tsai, Wu-Chin, Chang, Meng-Fan, Chien, Tun-Fei, King, Ya-Chin, Lin, Chrong-Jung
Published in IEEE transactions on electron devices (01.01.2015)
Published in IEEE transactions on electron devices (01.01.2015)
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Journal Article
Characterization of Multilayer Metal Gate Fuse in 28-nm CMOS Logic Technology
HSIEH, Min-Che, LIN, Yu-Cheng, CHIN, Yung-Wen, CHANG, Tzong-Sheng, KING, Ya-Chin, LIN, Chrong-Jung
Published in IEEE electron device letters (01.09.2013)
Published in IEEE electron device letters (01.09.2013)
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Journal Article
The use of MASW method in the assessment of soil liquefaction potential
Lin, Chih-Ping, Chang, Cheng-Chou, Chang, Tzong-Sheng
Published in Soil dynamics and earthquake engineering (1984) (01.10.2004)
Published in Soil dynamics and earthquake engineering (1984) (01.10.2004)
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Conference Proceeding
On-Chip Recovery Operation for Self-Aligned Nitride Logic Non-Volatile Memory Cells in High-K Metal Gate CMOS Technology
Lin, Po-Yen, Chiu, Yu-Lun, Sung, Yuh-Te, Chen, Jim, Chang, Tzong-Sheng, King, Ya-Chin, Lin, Chrong Jung
Published in IEEE journal of the Electron Devices Society (01.11.2015)
Published in IEEE journal of the Electron Devices Society (01.11.2015)
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Journal Article
Self-Rectifying Twin-Bit RRAM in 3-D Interweaved Cross-Point Array
Chen, Shu-En, Chin, Yung-Wen, Hsieh, Min-Che, Liao, Chu-Feng, Chang, Tzong-Sheng, Lin, Chrong-Jung, King, Ya-Chin
Published in IEEE journal of the Electron Devices Society (01.07.2015)
Published in IEEE journal of the Electron Devices Society (01.07.2015)
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Journal Article
Via Diode in Cu Backend Process for 3D Cross-Point RRAM Arrays
Liao, Yu-Cheng, Pan, Hsin-Wei, Hsieh, Min-Che, Chang, Tzong-Sheng, Chih, Yu-Der, Tsai, Ming-Jinn, Lin, Chrong Jung, King, Ya-Chin
Published in IEEE journal of the Electron Devices Society (01.11.2014)
Published in IEEE journal of the Electron Devices Society (01.11.2014)
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Multi-station analysis of surface wave dispersion
Lin, Chih-Ping, Chang, Tzong-Sheng
Published in Soil dynamics and earthquake engineering (1984) (01.12.2004)
Published in Soil dynamics and earthquake engineering (1984) (01.12.2004)
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Journal Article
Ultra high density 3D via RRAM in pure 28nm CMOS process
Min-Che Hsieh, Yu-Cheng Liao, Yung-Wen Chin, Chen-Hsin Lien, Tzong-Sheng Chang, Yue-Der Chih, Natarajan, Sreedhar, Ming-Jinn Tsai, Ya-Chin King, Chrong Jung Lin
Published in 2013 IEEE International Electron Devices Meeting (01.12.2013)
Published in 2013 IEEE International Electron Devices Meeting (01.12.2013)
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Conference Proceeding
Journal Article
Diffusion barrier study on TaSix and TaSixNy
Wang, Wen-Chun, Chang, Tzong-Sheng, Huang, Fon-Shan, Chen, Jiann-Ruey
Published in Thin solid films (25.11.1993)
Published in Thin solid films (25.11.1993)
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Journal Article
Rapid thermal nitridation of titanium on Cu/Si contact system
Chang, Tzong-Sheng, Wang, Wen-Chun, Huang, Fon-Shan, Wang, Lih-Ping, Hwang, Jenn-Chang
Published in Solid-state electronics (01.04.1995)
Published in Solid-state electronics (01.04.1995)
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Journal Article
Point twin-bit RRAM in 3D interweaved cross-point array by Cu BEOL process
Yung-Wen Chin, Shu-En Chen, Min-Che Hsieh, Tzong-Sheng Chang, Chrong Jung Lin, Ya-Chin King
Published in 2014 IEEE International Electron Devices Meeting (01.12.2014)
Published in 2014 IEEE International Electron Devices Meeting (01.12.2014)
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Conference Proceeding
A new saw-like self-recovery of interface states in nitride-based memory cell
Yuh-Te Sung, Po-Yen Lin, Jim Chen, Tzong-Sheng Chang, Ya-Chin King, Chrong Jung Lin
Published in 2014 IEEE International Electron Devices Meeting (01.12.2014)
Published in 2014 IEEE International Electron Devices Meeting (01.12.2014)
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Conference Proceeding
Thermal stability study of TiN/TiSi2 diffusion barrier between Cu and n +Si
Chang, Tzong-Sheng, Wang, Wen-Chun, Wang, Lih-Ping, Hwang, Jenn-Chang, Huang, Fon-Shan
Published in Journal of applied physics (15.06.1994)
Published in Journal of applied physics (15.06.1994)
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Journal Article
A high density Twin-Gate OTP cell in pure 28nm CMOS process
Woan Yun Hsiao, Chin Yu Mei, Wen Chao Shen, Tzong Sheng Chang, Yue Der Chih, Ya-Chin King, Chrong Jung Lin
Published in Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) (01.04.2014)
Published in Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) (01.04.2014)
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Conference Proceeding
Semiconductor structure with data storage structure and method for manufacturing the same
Hsiao, Woan-Yun, Chen, Huang-Kui, Chang, Tzong-Sheng, Lin, Chrong-Jung, King, Ya-Chin
Year of Publication 16.05.2023
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Year of Publication 16.05.2023
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Method of fabricating reticle
Liao, Chi-Hung, Chung, Hsueh-Yi, Chen, Yung-Cheng, Fu, Shih-Chi, Chang, Tzong-Sheng, Hsu, Wei-Ti, Chuang, Jui-Ping, Tsai, Fei-Gwo, Chen, Kuei-Shun, Chen, Meng-Wei
Year of Publication 26.03.2024
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Year of Publication 26.03.2024
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Methods for manufacturing semiconductor arrangements using photoresist masks
Chiang, Tsung-Yu, Kuang-Hsin, Chen, Tien, Bor-Zen, Chang, Tzong-Sheng
Year of Publication 23.03.2021
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Year of Publication 23.03.2021
Patent
SEMICONDUCTOR STRUCTURE WITH DATA STORAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
HSIAO, Woan-Yun, LIN, Chrong-Jung, CHANG, Tzong-Sheng, KING, Ya-Chin, CHEN, Huang-Kui
Year of Publication 17.12.2020
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Year of Publication 17.12.2020
Patent