Low-Power and Nanosecond Switching in Robust Hafnium Oxide Resistive Memory With a Thin Ti Cap
Lee, H.Y., Chen, Y.S., Chen, P.S., Wu, T.Y., Chen, F., Wang, C.C., Tzeng, P.J., Tsai, M.-J., Lien, C.
Published in IEEE electron device letters (01.01.2010)
Published in IEEE electron device letters (01.01.2010)
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Charge trapping characteristics of atomic-layer-deposited HfO2 films with Al2O3 as a blocking oxide for high-density non-volatile memory device applications
Maikap, S, Lee, H Y, Wang, T-Y, Tzeng, P-J, Wang, C C, Lee, L S, Liu, K C, Yang, J-R, Tsai, M-J
Published in Semiconductor science and technology (01.08.2007)
Published in Semiconductor science and technology (01.08.2007)
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Double Layers Omega FETs with Ferroelectric HfZrO2 for One-Transistor Memory
Chen, K.-T., Lo, C., Lin, Y.-Y., Chueh, C.-Y., Chang, C., Siang, G.-Y., Tseng, Y.-J., Yang, Y.-J., Hsieh, F.-C., Chang, S.-H., Liang, H., Chiang, S.-H., Liu, J.-H., Lin, Y.-D., Yeh, P.-C., Wang, C.-Y., Yang, H.-Y., Tzeng, P.-J., Liao, M.-H., Chang, S. T., Tseng, Y.-Y., Lee, M. H.
Published in 2020 IEEE International Reliability Physics Symposium (IRPS) (01.04.2020)
Published in 2020 IEEE International Reliability Physics Symposium (IRPS) (01.04.2020)
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Conference Proceeding
Novel SONOS-Type Nonvolatile Memory Device With Optimal Al Doping in HfAlO Charge-Trapping Layer
Ping-Hung Tsai, Kuei-Shu Chang-Liao, Chu-Yung Liu, Tien-Ko Wang, Tzeng, P.J., Lin, C.H., Lee, L.S., Tsai, M.-J.
Published in IEEE electron device letters (01.03.2008)
Published in IEEE electron device letters (01.03.2008)
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Ruthenium oxide metal nanocrystal capacitors with high- κ dielectric tunneling barriers for nanoscale nonvolatile memory device applications
Das, Atanu, Maikap, S., Lin, C.-H., Tzeng, P.-J., Tien, T.-C., Wang, T.-Y., Chang, L.-B., Yang, J.-R., Tsai, M.-J.
Published in Microelectronic engineering (01.10.2010)
Published in Microelectronic engineering (01.10.2010)
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Understanding Myeloma-Related Information Needs and Communication Preferences Within Black American Communities: An Exploratory Study
Esquivel, N S, Tzeng, J P, Treiman, K, Husick, C H, Sheridan, J, Ortiz-Ravick, L, Sae-Hau, M, Brown, L, DeMairo, K, Bell, N, Disare, K, Weiss, E S
Published in Journal of cancer education (16.08.2024)
Published in Journal of cancer education (16.08.2024)
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Feasibility Study of a 3D IC Integration System-in-Packaging (SiP) from a 300 mm Multi-Project Wafer (MPW)
LAU, J. H, ZHAN, C.-J, TAIN, R.-M, LIN, C.-H, HSIN, Y.-C, CHEN, C.-C, CHEN, S.-C, WU, C.-Y, CHEN, J.-C, CHIEN, C.-H, CHIANG, C.-W, CHANG, H.-H, TZENG, P.-J, TSAI, W.-L, CHENG, R.-S, HUANG, S.-Y, LIN, Y.-M, CHANG, T.-C, KO, C.-D, CHEN, T.-H, SHEU, S.-S, WU, S.-H, CHEN, Y.-H, LEE, C.-K, LO, W.-C, KU, T.-K, KAO, M.-J, HU, D.-C, DAI, M.-J, CHIEN, H.-C, CHAO, Y.-L, LI, W, WU, S.-T, HUNG, J.-F
Published in Journal of microelectronics and electronic packaging (01.10.2011)
Published in Journal of microelectronics and electronic packaging (01.10.2011)
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Patient Perceptions of Switching to a Generic Dry Powder Inhaler – Increased Understanding Through Journey Mapping
Ray, Sarah E, Boudewyns, Vanessa, Davis, Christine, Tzeng, Janice P, Srivastava, Ila, Oguntimein, Oluwamurewa, Conti, Denise S, Feibus, Karen B
Published in International journal of chronic obstructive pulmonary disease (01.01.2022)
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Suppression of Plasma Charging Damage in Sub-Micron Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs) with Gate Oxynitride by Two-Step Nitridation
Tzeng, Pei-Jer, Wu, Bone-Fung, Chang-Liao, Kuei-Shu
Published in Japanese Journal of Applied Physics (01.06.2001)
Published in Japanese Journal of Applied Physics (01.06.2001)
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Low current and voltage resistive switching memory device using novel Cu/Ta2O5/W structure
Rahaman, S.Z., Maikap, S., Lin, C.-H., Wu, T.-Y., Chen, Y.S., Tzeng, P.-J., Chen, F., Lai, C.S., Kao, M.-J., Tsai, M.-J.
Published in 2009 International Symposium on VLSI Technology, Systems, and Applications (01.04.2009)
Published in 2009 International Symposium on VLSI Technology, Systems, and Applications (01.04.2009)
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Conference Proceeding
Microstructural Evolution of Metal–Insulator–Metal Capacitor Prepared by Atomic-Layer-Deposition System at Elevated Temperature
Lin, C. H., Wang, C. C., Tzeng, P. J., Liang, C. S., Lo, W. M., Li, H. Y., Lee, L. S., Lo, S. C., Chou, Y. W., Tsai, M. J.
Published in Japanese Journal of Applied Physics (01.04.2006)
Published in Japanese Journal of Applied Physics (01.04.2006)
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Highly Thermally Stable and Reproducible of ALD RuO2 Nanocrystal Floating Gate Memory Devices with Large Memory Window and Good Retention
Maikap, S., Banerjee, W., Tzeng, P.-J., Wang, T.-Y., Lin, C.H., Tien, T.C., Lee, L.S., Yang, J.-R., Kao, M.-J., Tsai, M.-J.
Published in 2008 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) (01.04.2008)
Published in 2008 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) (01.04.2008)
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Plasma charging damage on MOS devices with gate insulator of high-dielectric constant material
Pei-Jer Tzeng, Yi-Yuan Chang, Kuei-Shu Chang-Liao
Published in IEEE electron device letters (01.11.2001)
Published in IEEE electron device letters (01.11.2001)
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Impact of slurry in Cu CMP (chemical mechanical polishing) on Cu topography of Through Silicon Vias (TSVs), re-distribution layers, and Cu exposure
Chen, J. C., Tzeng, P. J., Chen, S. C., Wu, C. Y., Chen, C. C., Hsin, Y. C., Lau, J. H., Hsu, Y. F., Shen, S. H., Liao, S. C., Ho, C. H., Lin, C. H., Ku, T. K., Kao, M. J.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Process integration for backside illuminated image sensor stacked with Analog-to-Digital Conversion chip
Chang, H. H., Chien, C. H., Lee, Y. C., Lee, S. M., Wang, J. C., Huang, Y. W., Zhan, C. J., Hsiao, Z. C., Tzeng, P. J., Lee, C. H., Chen, T. S., Ko, C. T., Lo, W. C., Kao, M. J.
Published in 2014 International Conference on Electronics Packaging (ICEP) (01.04.2014)
Published in 2014 International Conference on Electronics Packaging (ICEP) (01.04.2014)
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Conference Proceeding
Charge-Trapping-Type Flash Memory Device With Stacked High- k Charge-Trapping Layer
Ping-Hung Tsai, Kuei-Shu Chang-Liao, Te-Chiang Liu, Tien-Ko Wang, Pei-Jer Tzeng, Cha-Hsin Lin, Lee, L.S., Ming-Jinn Tsai
Published in IEEE electron device letters (01.07.2009)
Published in IEEE electron device letters (01.07.2009)
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