Analytical test of 3D integrated circuits
Robertazzi, Raphael, Scheurman, Micheal, Wordeman, Matt, Shurong Tian, Tyberg, Christy
Published in 2017 IEEE International Test Conference (ITC) (01.10.2017)
Published in 2017 IEEE International Test Conference (ITC) (01.10.2017)
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Conference Proceeding
TSV/FET proximity study using dense addressable transistor arrays
Robertazzi, Raphael, Agarwal, Kanak, Webb, Bucknell, Tyberg, Christy
Published in 2015 IEEE International Reliability Physics Symposium (01.04.2015)
Published in 2015 IEEE International Reliability Physics Symposium (01.04.2015)
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Conference Proceeding
Design and Modeling Methodology of Vertical Interconnects for 3DI Applications : THROUGH SILICON VIAS
GORDIN, Rachel, GOREN, David, SHLAFMAN, Shlomo, ELAD, Danny, SCHEUERMANN, Michael, YOUNG, Albert, FEI LIU, XIAOXIONG GU, TYBERG, Christy
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (2011)
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Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (2011)
Journal Article
Design and Modeling Methodology of Vertical Interconnects for 3DI Applications
Gordin, R, Goren, D, Shlafman, S, Elad, D, Scheuermann, M, Young, A, Fei Liu, Xiaoxiong Gu, Tyberg, C
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2011)
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Journal Article
Thermo-Compression Bonding and Mass Reflow Assembly Processes of 3D Logic Die Stacks
Gagnon, Pascale, Bergeron, Christian, Langlois, Richard, Barbeau, Stephane, Whitehead, Steve, Tyberg, Christy, Robertazzi, Ray, Sakuma, Katsuyuki, Wordeman, Matthew, Scheurmann, Michael
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
3D integration ESD protection design and analysis
Mitra, Souvick, Gebreselasie, Ephrem, You Li, Gauthier, Robert, Silberman, Joel, Tyberg, Christy, Sakuma, Katsuyuki, Thuy Tran-Quinn, Ramachandran, Koushik, Angyal, Matthew
Published in 2015 37th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD) (01.09.2015)
Published in 2015 37th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD) (01.09.2015)
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Conference Proceeding
Structure-property relationships of hydrido organo siloxane polymer (HOSP)
FORNOF, Ann R, TYBERG, Christy, HEDRICK, Jeffrey, LEE, Kang-Wook, COHEN, Stephen
Published in Polymer bulletin (Berlin, Germany) (01.04.2002)
Published in Polymer bulletin (Berlin, Germany) (01.04.2002)
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Journal Article
Assembly and packaging of non-bumped 3D chip stacks on bumped substrates
Dang, Bing, Maria, Joana, Chen, Qianwen, Nah, Jae-Woong, Andry, Paul, Tsang, Cornelia, Sakuma, Katsuyuki, Tyberg, Christy, Robertazzi, Raphael, Scheuermann, Michael, Gaynes, Michael, Knickerbocker, John
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
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Conference Proceeding
BEOL COMPATIBLE FET STRUCTURE
BERNSTEIN KERRY, TYBERG CHRISTY S, HOVEL HAROLD J, WISNIEFF ROBERT L, SAENGER KATHERINE L, CHU JACK O, BEDELL STEPHEN W
Year of Publication 05.03.2015
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Year of Publication 05.03.2015
Patent
BEOL compatible FET structrure
BERNSTEIN KERRY, TYBERG CHRISTY S, HOVEL HAROLD J, WISNIEFF ROBERT L, SAENGER KATHERINE L, CHU JACK O, BEDELL STEPHEN W
Year of Publication 29.10.2013
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Year of Publication 29.10.2013
Patent
BEOL compatible FET structure
BERNSTEIN KERRY, TYBERG CHRISTY S, HOVEL HAROLD J, WISNIEFF ROBERT L, SAENGER KATHERINE L, CHU JACK O, BEDELL STEPHEN W
Year of Publication 14.05.2013
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Year of Publication 14.05.2013
Patent