High K Metal Gate Aluminum CMP Challenges and Solutions
Xu, Kun, Chen, Yufei, Iravani, Hassan, Wang, Yuchun, Swedek, Bogdan, Yu, May, Wang, You, Tu, Wen-chiang, Xia, Sherry, Karuppiah, Lakshmanan
Published in ECS transactions (01.10.2010)
Published in ECS transactions (01.10.2010)
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Journal Article
Post-CMP Cleaning of Copper/Hydrophobic Low-k Dielectric Films
Chen, Yufei, Ko, Sen-Hou, Xu, Kun, Wang, Yuchun, Tu, Wen-Chiang, Karuppiah, Lakshmanan
Published in ECS transactions (15.05.2009)
Published in ECS transactions (15.05.2009)
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Journal Article
Impact of Film Morphology on Chemical Mechanical Polishing of Tungsten
Xu, Kun, Shen, Shih-Haur, Fung, Jason, Iravani, Hassan, Carlsson, Ingemar, Liu, Tzu-Yu, Swedek, Bogdan, Chang, Shou-Sung, Tu, Wen-chiang, Kitajima, Tomohiko, Mikhaylich, Katrina, Brown, Brian, Huey, Sidney, Redeker, Fritz
Published in ECS journal of solid state science and technology (01.01.2016)
Published in ECS journal of solid state science and technology (01.01.2016)
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Journal Article
Metal Clearing Process Control in Metal CMP
Xu, Kun, Carlsson, Ingemar, Liu, Tzu-Yu, Shen, Shih-Haur, Swedek, Bogdan, Wang, You, Xia, Xinyun, Bennett, Doyle, Tu, Wen-Chiang, Karuppiah, Lakshmanan
Published in ECS transactions (01.04.2013)
Published in ECS transactions (01.04.2013)
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Journal Article
CMP Process Technology in TSV Application
Wang, Yuchun, Gage, Max, Xia, Sherry, Tu, Wen-Chiang, Karuppiah, Lakshmanan
Published in ECS transactions (01.01.2010)
Published in ECS transactions (01.01.2010)
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Journal Article
CMP for Cu Interconnect with Advanced Barrier Materials
Wang, You, Gage, Max, Xu, Kun, Wang, Yuchun, Chen, Yufei, Xia, Sherry, Tu, Wen-chiang, Karuppiah, Lakshmanan
Published in ECS transactions (01.01.2010)
Published in ECS transactions (01.01.2010)
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Journal Article
CMP Process for Phase Change Materials
Liu, Feng Q, Ge, Chenhao, Xu, Kun, Ye, Mengqi, Wang, Yuchun, Chen, Yufei, Xia, Sherry, Rosenbusch, Anja, Duboust, Alain, Tu, Wen-Chiang, Karuppiah, Lakshmanan
Published in ECS transactions (15.05.2009)
Published in ECS transactions (15.05.2009)
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Journal Article
Improving Cu line Rs control using feed-forward information for CMP endpointing
Xiaoyuan Hu, Zhihong Wang, Wen-chiang Tu, Daxin Mao
Published in 2010 IEEE International Interconnect Technology Conference (01.06.2010)
Published in 2010 IEEE International Interconnect Technology Conference (01.06.2010)
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Conference Proceeding
Inductive monitoring of conductive loops
Iravani, Hassan G, Wang, Zhefu, Lu, Wei, Wang, Zhihong, Benvegnu, Dominic J, Carlsson, Ingemar, Swedek, Boguslaw A, Tu, Wen-Chiang
Year of Publication 11.08.2020
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Year of Publication 11.08.2020
Patent
Endpoint control of multiple substrate zones of varying thickness in chemical mechanical polishing
Jew, Stephen, Shen, Shih-Haur, Wang, Zhihong, Carlsson, Ingemar, Duboust, Alain, Zhang, Jimin, Swedek, Boguslaw A, Mai, David H, Tu, Wen-Chiang, Tran, Huyen
Year of Publication 17.03.2020
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Year of Publication 17.03.2020
Patent
Determination of gain for eddy current sensor
Iravani, Hassan G, Xu, Kun, Bennett, Doyle E, Shen, Shih-Haur, Carlsson, Ingemar, Liu, Tzu-Yu, Swedek, Boguslaw A, Tu, Wen-Chiang
Year of Publication 11.02.2020
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Year of Publication 11.02.2020
Patent
INDUCTIVE MONITORING OF CONDUCTIVE LOOPS
Iravani, Hassan G, Wang, Zhefu, Lu, Wei, Wang, Zhihong, Benvegnu, Dominic J, Carlsson, Ingemar, Swedek, Boguslaw A, Tu, Wen-Chiang
Year of Publication 31.01.2019
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Year of Publication 31.01.2019
Patent
Inductive monitoring of conductive trench depth
Iravani, Hassan G, Wang, Zhefu, Lu, Wei, Wang, Zhihong, Benvegnu, Dominic J, Carlsson, Ingemar, Swedek, Boguslaw A, Tu, Wen-Chiang
Year of Publication 16.10.2018
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Year of Publication 16.10.2018
Patent
DETERMINATION OF GAIN FOR EDDY CURRENT SENSOR
Iravani, Hassan G, Xu, Kun, Bennett, Doyle E, Shen, Shih-Haur, Carlsson, Ingemar, Liu, Tzu-Yu, Swedek, Boguslaw A, Tu, Wen-Chiang
Year of Publication 09.05.2019
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Year of Publication 09.05.2019
Patent
W CMP Initiation Mechanism Study Using in-Situ Metrologies
Xu, Kun, Liu, Tzu-Yu, Shen, Shih-Haur, Wang, You, Carlsson, Ingemar, Swedek, Bogdan, Kitajima, Tomohiko, Tu, Wen-Chiang
Published in Meeting abstracts (Electrochemical Society) (01.04.2014)
Published in Meeting abstracts (Electrochemical Society) (01.04.2014)
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Journal Article
MONITORING OF POLISHING PAD THICKNESS FOR CHEMICAL MECHANICAL POLISHING
Lee Harry Q, Brown Brian J, McClintock William H, Tu Wen-Chiang, Lu Wei, Zhang Jimin, Wang Zhihong
Year of Publication 01.03.2018
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Year of Publication 01.03.2018
Patent
Determination of gain for eddy current sensor
Iravani, Hassan G, Xu, Kun, Bennett, Doyle E, Shen, Shih-Haur, Carlsson, Ingemar, Liu, Tzu-Yu, Swedek, Boguslaw A, Tu, Wen-Chiang
Year of Publication 19.02.2019
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Year of Publication 19.02.2019
Patent
Substrate features for inductive monitoring of conductive trench depth
Iravani, Hassan G, Wang, Zhefu, Lu, Wei, Wang, Zhihong, McClintock, William H, Swedek, Boguslaw A, Redeker, Fred C, Tu, Wen-Chiang
Year of Publication 05.02.2019
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Year of Publication 05.02.2019
Patent
INDUCTIVE MONITORING OF CONDUCTIVE TRENCH DEPTH
Iravani Hassan G, Wang Zhefu, Benvegnu Dominic J, Swedek Boguslaw A, Carlsson Ingemar, Lu Wei, Tu Wen-Chiang, Wang Zhihong
Year of Publication 21.12.2017
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Year of Publication 21.12.2017
Patent