High levels of contamination and antimicrobial-resistant non-typhoidal Salmonella serovars on pig and poultry farms in the Mekong Delta of Vietnam
TU, L. T. P., HOANG, N. V. M., CUONG, N. V., CAMPBELL, J., BRYANT, J. E., HOA, N. T., KIET, B. T., THOMPSON, C., DUY, D. T., PHAT, V. V., HIEN, V. B., THWAITES, G., BAKER, S., CARRIQUE-MAS, J. J.
Published in Epidemiology and infection (01.10.2015)
Published in Epidemiology and infection (01.10.2015)
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Journal Article
Internet-based DFX for rapid and economical tool/mould making
Xie, S.Q., Tu, P.L., Zhou, Z.D.
Published in International journal of advanced manufacturing technology (01.12.2004)
Published in International journal of advanced manufacturing technology (01.12.2004)
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Journal Article
An Integral Sliding Model Tracking Strategy for 3D Laser Beam Position Control
Xie, S. Q., Tu, P.L., Sheng, B., Zhou, Z. D.
Published in International journal of advanced manufacturing technology (01.10.2001)
Published in International journal of advanced manufacturing technology (01.10.2001)
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Journal Article
Non‐Typhoidal Salmonella Colonization in Chickens and Humans in the Mekong Delta of Vietnam
Trung, N. V., Carrique‐Mas, J. J., Nghia, N. H., Tu, L. T. P., Mai, H. H., Tuyen, H. T., Campbell, J., Nhung, N. T., Nhung, H. N., Minh, P. V., Chieu, T. T. B., Hieu, T. Q., Mai, N. T. N., Baker, S., Wagenaar, J. A., Hoa, N. T., Schultsz, C.
Published in Zoonoses and public health (01.03.2017)
Published in Zoonoses and public health (01.03.2017)
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Journal Article
Reliability studies of μBGA solder joints-effect of Ni-Sn intermetallic compound
CHAN, Y. C, TU, P. L, TANG, C. W, HUNG, K. C, LAI, Joseph K. L
Published in IEEE transactions on advanced packaging (01.02.2001)
Published in IEEE transactions on advanced packaging (01.02.2001)
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Journal Article
Effect of intermetallic compounds on vibration fatigue of μBGA solder joint
TU, P. L, CHAN, Y. C, LAI, Joseph K. L
Published in IEEE transactions on advanced packaging (01.05.2001)
Published in IEEE transactions on advanced packaging (01.05.2001)
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Conference Proceeding
Journal Article
Endoscopic inspection of solder joint integrity in chip scale packages
Chan, Y.C., Tang, C.W., Tu, P.L.
Published in 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) (2000)
Published in 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) (2000)
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Conference Proceeding
Journal Article
Study of self-alignment of μBGA packages
HUNG, K. C, CHAN, Y. C, TU, P. L, ONG, H. C, WEBB, D. P, LAI, J. K. L
Published in IEEE transactions on advanced packaging (01.11.2000)
Published in IEEE transactions on advanced packaging (01.11.2000)
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Journal Article
Comparative study of micro-BGA reliability under bending stress
Tu, P.L., Chan, Y.C., Hung, K.C., Lai, J.K.L.
Published in IEEE transactions on advanced packaging (01.11.2000)
Published in IEEE transactions on advanced packaging (01.11.2000)
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Journal Article