CMOS image sensor structure with microstructures on backside surface of semiconductor layer
Yeh, Yu-Lung, Lin, Hsing-Chih, Tu, Chien-Nan, Chen, Shih-Shiung, Huang, Chien-Chang
Year of Publication 28.05.2024
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Year of Publication 28.05.2024
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IMAGE SENSOR WITH A HIGH ABSORPTION LAYER
Yeh, Yu-Lung, Tu, Chien Nan, Jiang, Ji Heng, Wu, Ming-Chi, Huang, Chien-Chang
Year of Publication 30.11.2023
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Year of Publication 30.11.2023
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Image sensor with a high absorption layer
Yeh, Yu-Lung, Tu, Chien Nan, Jiang, Ji Heng, Wu, Ming-Chi, Huang, Chien-Chang
Year of Publication 28.11.2023
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Year of Publication 28.11.2023
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Image sensor device with reflective structure
Yeh, Yu-Lung, Jiang, Ji-Heng, Tu, Chien-Nan, Wu, Ming-Chi, Chen, Shih-Shiung, Wen, Chi-Yuan, Fang, Chun-Chieh, Lin, Kun-Yu
Year of Publication 21.05.2024
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Year of Publication 21.05.2024
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CMOS image sensor structure with microstructures formed on semiconductor layer
Yeh, Yu-Lung, Lin, Hsing-Chih, Tu, Chien-Nan, Chen, Shih-Shiung, Huang, Chien-Chang
Year of Publication 16.11.2021
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Year of Publication 16.11.2021
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QE approach by double-side, multi absorption structure
Yeh, Yu-Lung, Tu, Chien Nan, Kuo, Hsin-Yi, Wu, Ming-Chi, Wen, Chi-Yuan, Huang, Po-Han
Year of Publication 19.07.2022
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Year of Publication 19.07.2022
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IMAGE SENSOR WITH A HIGH ABSORPTION LAYER
Yeh, Yu-Lung, Tu, Chien Nan, Jiang, Ji Heng, Wu, Ming-Chi, Huang, Chien-Chang
Year of Publication 25.03.2021
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Year of Publication 25.03.2021
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Image sensor with a high absorption layer
Yeh, Yu-Lung, Tu, Chien Nan, Jiang, Ji Heng, Wu, Ming-Chi, Huang, Chien-Chang
Year of Publication 15.12.2020
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Year of Publication 15.12.2020
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Deep Trench Isolation Structures Resistant to Cracking
Su, Bo-Chang, Yeh, Yu-Lung, Tu, Chien Nan, Wu, Ming-Chi, Chen, Shih-Shiung, Fang, Chun-Chieh, Lin, Kun-Yu
Year of Publication 28.07.2022
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Year of Publication 28.07.2022
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Image sensor device with reflective layer
Yeh, Yu-Lung, Jiang, Ji-Heng, Tu, Chien-Nan, Wu, Ming-Chi, Chen, Shih-Shiung, Wen, Chi-Yuan, Fang, Chun-Chieh, Lin, Kun-Yu
Year of Publication 24.05.2022
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Year of Publication 24.05.2022
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Deep trench isolation structures resistant to cracking
Su, Bo-Chang, Yeh, Yu-Lung, Tu, Chien Nan, Wu, Ming-Chi, Chen, Shih-Shiung, Fang, Chun-Chieh, Lin, Kun-Yu
Year of Publication 12.04.2022
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Year of Publication 12.04.2022
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QE APPROACH BY DOUBLE-SIDE, MULTI ABSORPTION STRUCTURE
Yeh, Yu-Lung, Tu, Chien Nan, Kuo, Hsin-Yi, Wu, Ming-Chi, Wen, Chi-Yuan, Huang, Po-Han
Year of Publication 22.04.2021
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Year of Publication 22.04.2021
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Image sensor with a high absorption layer
Yeh, Yu-Lung, Tu, Chien Nan, Jiang, Ji Heng, Wu, Ming-Chi, Huang, Chien-Chang
Year of Publication 04.02.2020
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Year of Publication 04.02.2020
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QE approach by double-side, multi absorption structure
Yeh, Yu-Lung, Tu, Chien Nan, Kuo, Hsin-Yi, Wu, Ming-Chi, Wen, Chi-Yuan, Huang, Po-Han
Year of Publication 29.12.2020
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Year of Publication 29.12.2020
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IMAGE SENSOR WITH A HIGH ABSORPTION LAYER
Yeh, Yu-Lung, Tu, Chien Nan, Jiang, Ji Heng, Wu, Ming-Chi, Huang, Chien-Chang
Year of Publication 05.12.2019
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Year of Publication 05.12.2019
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Image sensor with a high absorption layer
Yeh, Yu-Lung, Tu, Chien Nan, Jiang, Ji Heng, Wu, Ming-Chi, Huang, Chien-Chang
Year of Publication 08.10.2019
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Year of Publication 08.10.2019
Patent
QE approach by double-side, multi absorption structure
Yeh, Yu-Lung, Tu, Chien Nan, Kuo, Hsin-Yi, Wu, Ming-Chi, Wen, Chi-Yuan, Huang, Po-Han
Year of Publication 07.07.2020
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Year of Publication 07.07.2020
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