Search Results - "TSUYOSHI AMAKAWA" :: K.UTB vyhledávací portál

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WORK SUCKING BOARD, WORK CUTTING APPARATUS, WORK-CUTTING METHOD, AND FABRICATING METHOD FOR WORK SUCKING BOARD

by TSUYOSHI AMAKAWA, HAJIME WATANABE, KATSUNORI TSUTAFUJI
Year of Publication 30.04.2021

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SINGULATION APPARATUS FOR MANUFACTURING ELECTRONIC COMPONENT

by AMAKAWA TSUYOSHI
Year of Publication 01.10.2009

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Dicing device for electronic component separation

by AMAKAWA, TSUYOSHI
Year of Publication 30.09.2009

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Dicing device for electronic component separation

by AMAKAWA, TSUYOSHI
Year of Publication 08.07.2009

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INDIVIDUATING DEVICE FOR PRODUCING ELECTRONIC COMPONENT

by AMAKAWA TSUYOSHI
Year of Publication 24.02.2009

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METHOD OF COMPRESSION MOLDING FOR ELECTRONIC PART AND APPARATUS THEREFOR

by TAKASE, SHINJI, ONISHI, YOHEI, NAOKI, TAKADA, ODA, MAMORU, OTSUKI, OSAMU, AMAKAWA, TSUYOSHI, URAGAMI, HIROSHI
Year of Publication 18.01.2021

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METHOD OF COMPRESSION MOLDING FOR ELECTRONIC PART AND APPARATUS THEREFOR

by TAKASE, SHINJI, ONISHI, YOHEI, NAOKI, TAKADA, ODA, MAMORU, OTSUKI, OSAMU, AMAKAWA, TSUYOSHI, URAGAMI, HIROSHI
Year of Publication 18.01.2021

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TWI415200B

by AMAKAWA, TSUYOSHI
Year of Publication 11.11.2013

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Method for producing resin-encapsulated electronic component, bump-formed plate-like member, resin-encapsulated electronic component, and method for producing bump-formed plate-like member

by Amakawa Tsuyoshi, Okada Hirokazu, Uragami Hiroshi, Miura Muneo
Year of Publication 08.08.2017

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CUTTING APPARATUS AND CUTTING METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

by AMAKAWA TSUYOSHI, KATAOKA SHOICHI, MOCHIZUKI HIROTO
Year of Publication 01.07.2015

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Method for producing electronic component, bump-formed plate-like member, electronic component, and method for producing bump-formed plate-like member

by Amakawa Tsuyoshi, Okada Hirokazu, Uragami Hiroshi, Miura Muneo
Year of Publication 28.02.2017

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TWI551414B

by NAKAGAWARA, HIDEJI, AMAKAWA, TSUYOSHI
Year of Publication 01.10.2016

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MECHANISM OPENING AND CLOSING A DIE OF A RESIN SEAL APPARATUS

by TSUYOSHI AMAKAWA
Year of Publication 29.04.2004

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Mechanism opening and closing a die of a resin seal apparatus

by AMAKAWA, TSUYOSHI
Year of Publication 21.03.2004

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Storing device of indivisually separated meterial and storing method of the same

by YAMAMOTO, MASAYUKI, AMAKAWA, TSUYOSHI
Year of Publication 01.04.2016

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Electronic component, bump-formed plate-like member, and producing method

by AMAKAWA, TSUYOSHI, MIURA, MUNEO, OKADA, HIROKAZU, URAGAMI, HIROSHI
Year of Publication 27.01.2016

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METHOD FOR PRODUCING ELECTRONIC COMPONENT, BUMP-FORMED PLATE-LIKE MEMBER, ELECTRONIC COMPONENT, AND METHOD FOR PRODUCING BUMP-FORMED PLATE-LIKE MEMBER

by AMAKAWA TSUYOSHI, OKADA HIROKAZU, MIURA MUNEO, URAGAMI HIROSHI
Year of Publication 21.01.2016

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METHOD FOR PRODUCING RESIN-ENCAPSULATED ELECTRONIC COMPONENT, BUMP-FORMED PLATE-LIKE MEMBER, RESIN-ENCAPSULATED ELECTRONIC COMPONENT, AND METHOD FOR PRODUCING BUMP-FORMED PLATE-LIKE MEMBER

by AMAKAWA TSUYOSHI, OKADA HIROKAZU, MIURA MUNEO, URAGAMI HIROSHI
Year of Publication 29.10.2015

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Resin-encapsulated electronic component, bump-formed plate-like member, and methods for producing the two

by AMAKAWA, TSUYOSHI, MIURA, MUNEO, OKADA, HIROKAZU, URAGAMI, HIROSHI
Year of Publication 28.10.2015

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TWI492293B

by AMAKAWA, TSUYOSHI, WATANABE, HAJIME
Year of Publication 11.07.2015

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