Evaluation of Thermal Crack Propagation in Die-attached Joints Due to Cyclic Energization by Synchrotron Radiation Laminography Monitoring
Ooi, Junya, Mori, Takao, Tsuritani, Hiroyuki, Sayama, Toshihiko, Okamoto, Yoshiyuki, Hoshino, Masato, Uesugi, Kentaro
Published in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) (01.12.2018)
Published in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) (01.12.2018)
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Conference Proceeding
Nondestructive observation of fatigue crack propagation process in some solder joints by synchrotron radiation X-ray micro-tomography
Tsuritani, Hiroyuki, Sayama, Toshihiko, Okamoto, Yoshiyuki, Takayanagi, Takeshi, Uesugi, Kentaro, Mori, Takao
Published in 2013 3rd IEEE CPMT Symposium Japan (01.11.2013)
Published in 2013 3rd IEEE CPMT Symposium Japan (01.11.2013)
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Conference Proceeding
METHOD AND DEVICE FOR MEASUREMENT OF TEMPERATURE USING ULTRASONIC WAVE
SASAKI KATSUHIRO, IWATSUBO SATOSHI, TSURITANI HIROYUKI, TSUKAMOTO YOSHITOSHI, KINOSHITA MASAYUKI
Year of Publication 30.09.2010
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Year of Publication 30.09.2010
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