Hypervalent Bond Formation in Halogeno(2-acylphenyl)bismuthanes
Murafuji, Toshihiro, Mutoh, Takanori, Satoh, Kohichi, Tsunenari, Kazumi, Azuma, Nagao, Suzuki, Hitomi
Published in Organometallics (01.08.1995)
Published in Organometallics (01.08.1995)
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Journal Article
A half-micron pitch Cu interconnection technology
Ueno, K., Ohto, K., Tsunenari, K.
Published in 1995 Symposium on VLSI Technology. Digest of Technical Papers (1995)
Published in 1995 Symposium on VLSI Technology. Digest of Technical Papers (1995)
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Conference Proceeding
Barrier layerless submicron aluminum-damascene interconnection using aluminum chemical vapor deposition with a new nucleation method
Shinzawa, Tsutomu, Sugai, Kazumi, Hayashi, Yoshihiro, Nakajima, Tsutomu, Kishida, Shunji, Okabayashi, Hidekazu, Tsunenari, Kinji, Murao, Yukinobu, Kobayashi, Akiko, Yako, Tadaaki
Published in Electronics & communications in Japan. Part 2, Electronics (1996)
Published in Electronics & communications in Japan. Part 2, Electronics (1996)
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Journal Article
Quarter-micron interconnection technologies for 256 Mbit dynamic random access memories
KIKKAWA, T, KIKUTA, K, TSUNENARI, K, OHTO, K, AOKI, H, DRYNAN, J. M, KASAI, N, KUNIO, T
Published in JPN J APPL PHYS PART 1 REGUL PAP SHORT NOTE (1993)
Published in JPN J APPL PHYS PART 1 REGUL PAP SHORT NOTE (1993)
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Conference Proceeding
Journal Article
A quarter-micron planarized interconnection technology with self-aligned plug
Ueno, Ohto, Tsunenari, Kajiyana, Kikuta, Kikkawa
Published in 1992 International Technical Digest on Electron Devices Meeting (1992)
Published in 1992 International Technical Digest on Electron Devices Meeting (1992)
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Conference Proceeding
Adhesion layerless submicron Al damascene interconnections using novel Al-CVD
Shinzawa, T., Sugai, K., Kobayashi, A., Hayashi, Y., Nakajima, T., Kishida, S., Okabayashi, H., Yako, T., Tsunenari, K., Murao, Y.
Published in Proceedings of 1994 VLSI Technology Symposium (1994)
Published in Proceedings of 1994 VLSI Technology Symposium (1994)
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Conference Proceeding