Apparatus for inspecting land-attached circuit board
NAGASAKI MASATO, TSUNEKAWA TOMOYOSHI, MATSUBARA YOICHI, KOTAGIRI AKIRA
Year of Publication 21.08.2001
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Year of Publication 21.08.2001
Patent
Inspection of solder bumps of bump-attached circuit board
MATSUBARA; YOICHI, TSUNEKAWA; TOMOYOSHI, NAGASAKI; MASATO, KOTAGIRI; AKIRA
Year of Publication 22.02.2000
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Year of Publication 22.02.2000
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APPARATUS FOR INSPECTING SUBSTRATE WITH LAND
NAGASAKI MASATO, TSUNEKAWA TOMOYOSHI, ODAGIRI AKIRA, MATSUBARA YOICHI
Year of Publication 24.12.1999
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Year of Publication 24.12.1999
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DEVICE AND METHOD FOR INSPECTING BUMPY BOARD AND MANUFACTURE OF BUMPY BOARD
NAGASAKI MASATO, TSUNEKAWA TOMOYOSHI, ODAGIRI AKIRA, MATSUBARA YOICHI
Year of Publication 19.10.1999
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Year of Publication 19.10.1999
Patent