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The way to zeros: The future of semiconductor device and chemical mechanical polishing technologies

The way to zeros: The future of semiconductor device and chemical mechanical polishing technologies

by Tsujimura, Manabu
Published in Japanese Journal of Applied Physics (01.06.2016)

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Journal Article

Preface—Japan Vacuum Show “VACUUM2013”

Preface—Japan Vacuum Show “VACUUM2013”

by TSUJIMURA, Manabu
Published in Journal of the Vacuum Society of Japan (2013)

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Journal Article

Preface—Japan Vacuum Show “VACUUM2012”

Preface—Japan Vacuum Show “VACUUM2012”

by TSUJIMURA, Manabu
Published in Journal of the Vacuum Society of Japan (2012)

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Journal Article

CMP legend: revolution and evolution

CMP legend: revolution and evolution

by Tsujimura, Manabu
Published in Japanese Journal of Applied Physics (01.08.2022)

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Journal Article

Influence of Wafer Edge Geometry on Removal Rate Profile in Chemical Mechanical Polishing: Wafer Edge Roll-Off and Notch

by Fukuda, Akira, Fukuda, Tetsuo, Fukunaga, Akira, Tsujimura, Manabu
Published in Japanese Journal of Applied Physics (01.05.2012)

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Journal Article

Influence of Wafer Edge Geometry on Removal Rate Profile in Chemical Mechanical Polishing: Wafer Edge Roll-Off and Notch

by Fukuda, Akira, Fukuda, Tetsuo, Fukunaga, Akira, Tsujimura, Manabu
Published in Japanese Journal of Applied Physics (01.05.2012)

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Journal Article

Polishing

Polishing

by Tsujimura, Manabu
Published in Hyōmen gijutsu (01.02.2010)

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Journal Article

Enhanced Open Innovation: CMP Innovation to Open New Paradigm

Enhanced Open Innovation: CMP Innovation to Open New Paradigm

by Tsujimura, Manabu
Published in ECS journal of solid state science and technology (2019)

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Journal Article

Electrochemical Reactions During Ru Chemical Mechanical Planarization and Safety Considerations

Electrochemical Reactions During Ru Chemical Mechanical Planarization and Safety Considerations

by Shima, Shohei, Wada, Yutaka, Tokushige, Katsuhiko, Fukunaga, Akira, Tsujimura, Manabu
Published in Japanese Journal of Applied Physics (01.05.2011)

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Journal Article

Electrochemical Reactions During Ru Chemical Mechanical Planarization and Safety Considerations

Electrochemical Reactions During Ru Chemical Mechanical Planarization and Safety Considerations

by Shima, Shohei, Wada, Yutaka, Tokushige, Katsuhiko, Fukunaga, Akira, Tsujimura, Manabu
Published in Japanese Journal of Applied Physics (01.05.2011)

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Journal Article

Analysis on Copper Photocorrosion Induced by Illuminance in Chemical Mechanical Planarization Equipment Using Photodiode and Quartz Crystal Microbalance

Analysis on Copper Photocorrosion Induced by Illuminance in Chemical Mechanical Planarization Equipment Using Photodiode and Quartz Crystal Microbalance

by Shima, Shohei, Wada, Yutaka, Tokushige, Katsuhiko, Fukunaga, Akira, Tsujimura, Manabu
Published in Japanese Journal of Applied Physics (01.05.2010)

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Journal Article

Paradigm Cliff 2020 - The future of semi-conductor device and CMP technologies

Paradigm Cliff 2020 - The future of semi-conductor device and CMP technologies

by Tsujimura, Manabu
Published in Proceedings of International Conference on Planarization/CMP Technology 2014 (01.11.2014)

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Conference Proceeding

VACUUM2013—真空展開催にあたって

VACUUM2013—真空展開催にあたって

by 辻村, 学
Published in Journal of the Vacuum Society of Japan (2013)

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Journal Article

Effects of Liner Metal and CMP Slurry Oxidizer on Copper Galvanic Corrosion

Effects of Liner Metal and CMP Slurry Oxidizer on Copper Galvanic Corrosion

by Shima, Shohei, Fukunaga, Akira, Tsujimura, Manabu
Published in ECS transactions (28.09.2007)

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Journal Article

VACUUM2012―真空展開催にあたって

VACUUM2012―真空展開催にあたって

by 辻村, 学
Published in Journal of the Vacuum Society of Japan (2012)

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Journal Article

SUPPLY DEVICE OF POLISHING LIQUID, SUPPLY METHOD, AND SUBSTRATE POLISHING METHOD

SUPPLY DEVICE OF POLISHING LIQUID, SUPPLY METHOD, AND SUBSTRATE POLISHING METHOD

by TSUJIMURA MANABU, FUKUNAGA AKIRA
Year of Publication 17.12.2020

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Patent

Localized Oxidation of the Cu Surface after Chemical Mechanical Planarization Processing

Localized Oxidation of the Cu Surface after Chemical Mechanical Planarization Processing

by Kodera, Masako, Nishioka, Yukiko, Shima, Shohei, Fukunaga, Akira, Tsujimura, Manabu
Published in Japanese Journal of Applied Physics (01.12.2005)

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Journal Article

METHOD AND APPARATUS FOR DIVIDING SUBSTRATE ON WHICH DEVICE IS FORMED INTO INDIVIDUAL CHIPS

METHOD AND APPARATUS FOR DIVIDING SUBSTRATE ON WHICH DEVICE IS FORMED INTO INDIVIDUAL CHIPS

by TSUJIMURA MANABU, FUKUNAGA AKIRA
Year of Publication 06.06.2019

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Patent

METHOD AND VEHICLE FOR DIVIDING SUBSTRATE HAVING DEVICE FORMED THEREON INTO INDIVIDUAL CHIPS

METHOD AND VEHICLE FOR DIVIDING SUBSTRATE HAVING DEVICE FORMED THEREON INTO INDIVIDUAL CHIPS

by FUKUNAGA, Akira, TSUJIMURA, Manabu
Year of Publication 16.05.2019

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Patent

PUMP FOR SEWAGE

PUMP FOR SEWAGE

by SASAKI KAORI, TSUJIMURA MANABU
Year of Publication 15.11.2018

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Patent

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