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OPTICAL WAVEGUIDE, OPTICAL WAVEGUIDE MANUFACTURING METHOD, AND OPTICAL MODULE
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COMPOSITE METAL LAYER PROVIDED WITH SUPPORTING BODY METAL FOIL, WIRING BOARD USING THE COMPOSITE METAL LAYER, METHOD FOR MANUFACTURING THE WIRING BOARD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING THE WIRING BOARD
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Year of Publication 06.10.2011
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SUBSTRATE FOR MOUNTING SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING SAME
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Year of Publication 10.03.2011
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Influence of electroless PD plating film thickness on solder ball joint reliability
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Published in 2018 Pan Pacific Microelectronics Symposium (Pan Pacific) (01.02.2018)
Published in 2018 Pan Pacific Microelectronics Symposium (Pan Pacific) (01.02.2018)
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Year of Publication 04.04.2002
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Solder Ball Joint Reliability with Electroless Ni/Pd/Au Plating-Influence of Electroless Pd Plating Film Thickness
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Published in SMT (Online) (01.01.2017)
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Published in SMT (Online) (01.01.2017)
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OPTICAL WAVEGUIDE, OPTICAL WAVEGUIDE MANUFACTURING METHOD, AND OPTICAL MODULE
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Year of Publication 01.09.2016
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Year of Publication 28.09.1995
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Year of Publication 28.09.1995
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Optical waveguide, optical waveguide manufacturing method, and optical module
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Substrate for mounting semiconductor chip and method for producing same
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SUBSTRATE FOR MOUNTING SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THE SAME
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Year of Publication 27.12.1996
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Year of Publication 27.12.1996
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SEMICONDUCTOR CHIP MOUNTING SUBSTRATE AND MANUFACTURING METHOD OF THE SAME
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Year of Publication 16.05.2013
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