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"TSI CHIEN-WEN"
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"TSI CHIEN-WEN"
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Bumping process and bump structure
by
TSI CHIEN
-
WEN
,
HU CHUN-PING
,
LEE YUING
,
CHEN CHENGUNG
Year of Publication
09.06.2009
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Bumping process and bump structure
by
Hu, Chun-Ping
,
Chen, Cheng-Chung
,
Tsi
,
Chien
-
Wen
,
Lee, Yu-Ching
Year of Publication
09.06.2009
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Bumping process and bump structure
by
Hu, Chun-Ping
,
Chen, Cheng-Chung
,
Tsi
,
Chien
-
Wen
,
Lee, Yu-Ching
Year of Publication
09.06.2009
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Bumping process and bump structure
by
TSI CHIEN
-
WEN
,
HU CHUN-PING
,
LEE YUING
,
CHEN CHENGUNG
Year of Publication
09.06.2009
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Bumping process and bump structure
by
TSI CHIEN
-
WEN
,
HU CHUN-PING
,
LEE YUING
,
CHEN CHENGUNG
Year of Publication
14.08.2008
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FORMING METHOD AND STRUCTURE OF BUMP
by
TSI CHIEN
-
WEN
,
HU CHUN-PING
,
LEE YUING
,
CHIN SEICHU
Year of Publication
02.11.2006
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Bumping process and bump structure
by
TSI CHIEN
-
WEN
,
HU CHUN-PING
,
LEE YUING
,
CHEN CHENGUNG
Year of Publication
19.10.2006
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Touchpad structure and its manufacturing method
by
HO, MING-LONG
,
TSI
,
CHIEN
-
WEN
,
LIN, YU-KAI
Year of Publication
16.09.2013
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Packaging structure for reducing optical sensor from particle pollution and its process
by
HU, CHUN-PIN
,
CHIU, YENANG
,
TSI
,
CHIEN
-
WEN
Year of Publication
01.07.2005
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TWI297204B
by
TSI
,
CHIEN WEN
,
HE, MING-LONG
,
HU, JUN-PING
Year of Publication
21.05.2008
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Chip with structure of bumps
by
HE, MING-LONG
,
HU, JUN-PING
,
TSI
,
CHIEN
-
WEN
Year of Publication
01.05.2007
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Bumping process and bump structure
by
HU, CHUN-PIN
,
CHEN, CHENGUNG
,
TSI
,
CHIEN
-
WEN
,
LEE, YUING
Year of Publication
01.11.2006
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