Highly Emissive Cyclometalated Rhenium Metallacycles: Structure−Luminescence Relationship
Tseng, Yi-Hsiu, Bhattacharya, Dibyendu, Lin, Shih-Ming, Thanasekaran, P, Wu, Jing-Yun, Lee, Li-Wei, Sathiyendiran, M, Ho, Mei-Lin, Chung, Min-Wen, Hsu, Kung-Chung, Chou, Pi-Tai, Lu, Kuang-Lieh
Published in Inorganic chemistry (02.08.2010)
Published in Inorganic chemistry (02.08.2010)
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Journal Article
The reaction mechanism of cupric oxide reduction under hydrogen plasma treatment for epoxy molding compound / lead-frames adhesion improve
Min-Fong Shu, Bret Yang, Webber Liu, Yi-Hsiu Tseng
Published in 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2016)
Published in 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2016)
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Conference Proceeding
A Rigidity-Modulated Approach toward the Construction of Metallacycles from a Flexible Tetratopic Ligand
Chuang, Chuan-Hung, Sathiyendiran, Malaichamy, Tseng, Yi-Hsiu, Wu, Jing-Yun, Hsu, Kung-Chung, Hung, Chen-Hsiung, Wen, Yuh-Sheng, Lu, Kuang-Lieh
Published in Organometallics (25.01.2010)
Published in Organometallics (25.01.2010)
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Journal Article
Fatigue response of polyimide thin film under cyclic loading
Yu-Chen Chang, Tz-Cheng Chiu, Yu-Ting Yang, Yi-Hsiu Tseng, Xi-Hong Chen, Pu-Shan Huang
Published in 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2015)
Published in 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2015)
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Conference Proceeding
Concept for Planning the Nurse-Patient Ratio and Nursing Fee Payment Linkage System
Lu, Meei-Shiow, Tseng, Hsiu-Yi, Liang, Shu-Yuan, Lin, Chiou-Fen
Published in Hu li za zhi (01.02.2017)
Published in Hu li za zhi (01.02.2017)
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Journal Article
A Viscoplastic-Based Fatigue Reliability Model for the Polyimide Dielectric Thin Film
Chang, Yu-Chen, Chiu, Tz-Cheng, Yang, Yu-Ting, Tseng, Yi-Hsiu, Chen, Xi-Hong
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding
The Best EMC Mold Flow Behavior Simulation by Spiral Flow Benchmarking
Chen, Xi Hong, Tien Yen, Chin, Yang, Yu Ting, Ling Ma, Wei, Tseng, Yi-Hsiu, Hsu, Chih Chung
Published in 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2018)
Published in 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2018)
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Conference Proceeding
Physical Aging of Epoxy Molding Compound and Its Influences on the Warpage of Reconstituted Wafer
Chiu, Tz-Cheng, Yin, Wei-Jie, Yeh, En-Yu, Yang, Yu-Ting, Chen, Dao-Long, Tseng, Yi-Hsiu
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Lead-frames copper oxidation effect for a QFN package delamination improvement
Min-Fong Shu, Koduck Chen, Bret Yang, Liu, Webber, Yi-Hsiu Tseng
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
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Conference Proceeding
Effect of a clinical pathway on selected clinical outcomes of pulmonary lobectomy
Lee, Shih-Chun, Tseng, Hsiu-Yi, Wang, Kwua-Yun, Lee, Li-Chuan
Published in Zhonghua yi xue za zhi (Taipei, Taiwan) (01.01.2002)
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Published in Zhonghua yi xue za zhi (Taipei, Taiwan) (01.01.2002)
Journal Article
Concept for Planning the Nurse-Patient Ratio and Nursing Fee Payment Linkage System
Lu, Meei-Shiow, Tseng, Hsiu-Yi, Liang, Shu-Yuan, Lin, Chiou-Fen
Published in Hu li za zhi (01.02.2017)
Published in Hu li za zhi (01.02.2017)
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Journal Article
Evaluation of Superplastic Formability for a 5083 Al-Mg alloy
Tseng, Yi-Hsiu, Chuang, Tung-Han
Published in International journal of materials research (01.06.1999)
Published in International journal of materials research (01.06.1999)
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Journal Article