Development of Non-TSV Interposer (NTI) for High Electrical Performance Package
Fang-Yu Liang, Hung-Hsien Chang, Wen-Tsung Tseng, Lai, J. Y., Cheng, Stephen, Ma, Mike, Ramalingam, Suresh, Xin Wu, Gandhi, Jaspreet
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
Thermal cycling effect on intermetallic formation with various surface finish of micro bump interconnect for 3D package
Mu-Hsuan Chan, Yi-Chian Liao, Chun-Tang Lin, Kuan-Weir Chuang, Huei-Nuan Huang, Chi-Tung Yeh, Wen-Tsung Tseng, Jeng-Yuan Lai
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
Development of thermal compression bonding with Non Conductive Paste for 3DIC fine pitch copper pillar bump interconnections
Chien-Feng Chan, Wen-Tsung Tseng, Huei-Nuan Huang, Pin Huang, Mu-Hsuan Chan, Chun-Tang Lin, Liu, M., Chi-Hsin Chiu, Chiu, S., Ma, M.
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
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Conference Proceeding
Reliability of thermal compression bond combine with non conductive paste process in fine pitch micro-bumps soldering
Chien-Feng Chan, Wen-Tsung Tseng, Huei-Nuan Huang, Mu-Hsuan Chan, Chun-Tang Lin, Chi-Hsin Chiu
Published in 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2011)
Published in 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2011)
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Conference Proceeding
Substrate structure
Huang, Chen-Yu, Lai, Yi-Che, Tseng, Wen-Tsung, Liang, Fang-Yu, Chang, Hung-Hsien
Year of Publication 05.02.2019
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Year of Publication 05.02.2019
Patent
Substrate structure
Huang, Chen-Yu, Lai, Yi-Che, Tseng, Wen-Tsung, Liang, Fang-Yu, Chang, Hung-Hsien
Year of Publication 14.08.2018
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Year of Publication 14.08.2018
Patent
SUBSTRATE STRUCTURE
Lai Yi-Che, Chang Hung-Hsien, Huang Chen-Yu, Tseng Wen-Tsung, Liang Fang-Yu
Year of Publication 02.11.2017
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Year of Publication 02.11.2017
Patent
ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF
Lai Yi-Che, Chang Hung-Hsien, Tseng Wen-Tsung, Yeh Yu-Ling, Tsai Jyun-Ling
Year of Publication 26.10.2017
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Year of Publication 26.10.2017
Patent
SUBSTRATE STRUCTURE
Lai Yi-Che, Chang Hung-Hsien, Huang Chen-Yu, Tseng Wen-Tsung, Liang Fang-Yu
Year of Publication 10.08.2017
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Year of Publication 10.08.2017
Patent