METHOD FOR MANUFACTURING COMPOSITE LAYER CIRCUIT STRUCTURE OF ELECTRONIC DEVICE
Tseng, Hung-I, Chen, Ching-Wei, Chiu, Tzu-Yen, Fan, Chun-Chin, Chang, Yu-Jen
Year of Publication 08.06.2023
Get full text
Year of Publication 08.06.2023
Patent
MANUFACTURING METHOD OF PACKAGE STRUCTURE OF ELECTRONIC DEVICE
Tseng, Hung-I, Chen, Ching-Wei, Yeh, Chuan-Ming, Chiu, Tzu-Yen, Yeh, Heng-Shen, Chang, Yu-Jen
Year of Publication 27.07.2023
Get full text
Year of Publication 27.07.2023
Patent
ELECTRONIC DEVICE
KAO, Ker-Yih, TSENG, Chia-Ping, CHEN, Huei-Ying, HO, Chia-Chi, WU, Shu-Ling, TSENG, Hung-I, WENG, Ming-Yen
Year of Publication 16.05.2024
Get full text
Year of Publication 16.05.2024
Patent
Electronic device
Tseng, Hung-I, Chen, Huei-Ying, Ho, Chia-Chi, Wu, Shu-Ling, Tseng, Chia-Ping, Weng, Ming-Yen, Kao, Ker-Yih
Year of Publication 13.02.2024
Get full text
Year of Publication 13.02.2024
Patent
ELECTRONIC DEVICE
KAO, Ker-Yih, TSENG, Chia-Ping, CHEN, Huei-Ying, HO, Chia-Chi, WU, Shu-Ling, TSENG, Hung-I, WENG, Ming-Yen
Year of Publication 05.01.2023
Get full text
Year of Publication 05.01.2023
Patent
Electronic device and antenna device
Tseng, Hung-I, Chen, Huei-Ying, Ho, Chia-Chi, Wu, Shu-Ling, Tseng, Chia-Ping, Weng, Ming-Yen, Kao, Ker-Yih
Year of Publication 11.10.2022
Get full text
Year of Publication 11.10.2022
Patent
Manufacturing method of multiple layers of circuit structure of electronic device
CHANG, YU-JEN, FAN, CHUNIN, TSENG, HUNG-I, CHEN, CHING-WEI, CHIU, TZU-YEN
Year of Publication 01.03.2024
Get full text
Year of Publication 01.03.2024
Patent
MICROWAVE MODULATION DEVICE
KAO, Ker-Yih, LI, I-Yin, HO, Chia-Chi, SUNG, Li-Wei, SU, Charlene, TSENG, Hung-I, LO, Kuo-Chun, LIN, Yi-Hung, WENG, Ming-Yen
Year of Publication 04.08.2021
Get full text
Year of Publication 04.08.2021
Patent
ELECTRONIC DEVICE AND ANTENNA DEVICE
KAO, Ker-Yih, TSENG, Chia-Ping, CHEN, Huei-Ying, HO, Chia-Chi, WU, Shu-Ling, TSENG, Hung-I, WENG, Ming-Yen
Year of Publication 06.08.2020
Get full text
Year of Publication 06.08.2020
Patent
Manufacturing method of multiple layers of circuit structure of electronic device
CHANG, YU-JEN, FAN, CHUNIN, TSENG, HUNG-I, CHEN, CHING-WEI, CHIU, TZU-YEN
Year of Publication 16.06.2023
Get full text
Year of Publication 16.06.2023
Patent
Manufacturing method of package structure of electronic device
CHANG, YU-JEN, YEH, CHUAN-MING, YEH, HENG-SHEN, TSENG, HUNG-I, CHEN, CHING-WEI, CHIU, TZU-YEN
Year of Publication 11.10.2023
Get full text
Year of Publication 11.10.2023
Patent
Microwave modulation device
Tseng, Hung-I, Ho, Chia-Chi, Lin, Yi-Hung, Lo, Kuo-Chun, Su, Charlene, Li, I-Yin, Weng, Ming-Yen, Sung, Li-Wei, Kao, Ker-Yih
Year of Publication 29.10.2019
Get full text
Year of Publication 29.10.2019
Patent
Manufacturing method of package structure of electronic device
CHANG, YU-JEN, YEH, CHUAN-MING, YEH, HENG-SHEN, TSENG, HUNG-I, CHEN, CHING-WEI, CHIU, TZU-YEN
Year of Publication 01.08.2023
Get full text
Year of Publication 01.08.2023
Patent