by Lee, Tzu-Nien, Lau, John-H, Ko, Cheng-Ta, Xia, Tim, Lin, Eagle, Yang, Kai-Ming, Lin, Puru-Bruce, Peng, Chia-Yu, Chang, Leo, Chen, Jia-Shiang, Fang, Yi-Hsiu, Liao, Li-Yueh, Charn, Edward, Wang, Jason, Tseng, Tzyy-Jang
Published in Materials (24.03.2022)

by Chou, Tzu-Chieh, Yang, Kai-Ming, Li, Jian-Chen, Yu, Ting-Yang, Yang, Yu-Tao, Hu, Han-Wen, Liu, Yu-Wei, Ko, Cheng-Ta, Chen, Yu-Hua, Tseng, Tzyy-Jang, Chen, Kuan-Neng
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2020)

by Yang, Yu-Tao, Chou, Tzu-Chieh, Yu, Ting-Yang, Chang, Yu-Wei, Huang, Tai-Yuan, Yang, Kai-Ming, Ko, Cheng-Ta, Chen, Yu-Hua, Tseng, Tzyy-Jang, Chen, Kuan-Neng
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2017)

by Lau, John H., Chen, Gary Chang-Fu, Huang, Jones Yu-Cheng, Chou, Ricky Tsun-Sheng, Yang, Channing Cheng-Lin, Liu, Hsing-Ning, Tseng, Tzyy-Jang
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2021)

by Lau, John H., Ko, Cheng-Ta, Yang, Kai-Ming, Peng, Chia-Yu, Xia, Tim, Lin, Puru Bruce, Chen, J. J., Huang, Patrick Po-Chun, Liu, Hsing-Ning, Tseng, Tzyy-Jang, Lin, Eagle, Chang, Leo
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2020)

by Lau, John H., Lin, Curry, Liu, Hsing-Ning, Yang, Kai-Ming, Xia, Tim, Ko, Cheng-Ta, Lin, Bruce Puru, Chuang, Yu-Ling, Chen, R., Ma, M., Tseng, Tzyy-Jang, Li, Ming, Leung, K.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2023)

by Tsun-Sheng Chou, Ricky, Lau, John H., Chang-Fu Chen, Gary, Yu-Cheng Huang, Jones, Cheng-Lin Yang, Channing, Liu, Hsing-Ning, Tseng, Tzyy-Jang
Published in Journal of microelectronics and electronic packaging (01.01.2022)

by Peng, Tony Chia-Yu, Lau, John H., Ko, Cheng-Ta, Lee, Paul, Lin, Eagle, Yang, Kai-Ming, Lin, Bruce Puru, Xia, Tim, Chang, Leo, Liu, Hsing-Ning, Lin, Curry, Lee, Tzu Nien, Wong, Jason, Ma, Mike, Tseng, Tzyy-Jang
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2022)

by Lau, John H., Ko, Cheng-Ta, Tseng, Tzyy-Jang, Yang, Kai-Ming, Peng, Tony Chia-Yu, Xia, Tim, Lin, Puru Bruce, Lin, Eagle, Chang, Leo, Liu, Hsing Ning, Cheng, David
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2020)

by Lin, Puru Burce, Cheng-Ta Ko, Wei-Tse Ho, Chi-Hai Kuo, Kuan-Wen Chen, Yu-Hua Chen, Tzyy-Jang Tseng
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)

by Yu-Tao Yang, Ting-Yang Yu, Shu-Chiao Kuo, Tai-Yuan Huang, Kai-Ming Yang, Cheng-Ta Ko, Yu-Hua Chen, Tzyy-Jang Tseng, Kuan-Neng Chen
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)

by Chen, Gary Chang-Fu, Lau, John H, Yang, Channing Cheng-Lin, Huang, Jones Yu-Cheng, Peng, Andy Yan-Jia, Liu, Hsing-Ning, Tseng, Tzyy-Jang, Li, Ming
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)

by CHEN TSUNG YUAN, TSENG TZYY JANG
Year of Publication 12.06.2014

by Peng, Chia-Yu, Lau, John H, Ko, Cheng-Ta, Lee, Paul, Lin, Eagle, Yang, Henry Kai-Ming, Lin, Puru Bruce, Xia, Tim, Chang, Leo, Lin, Curry, Lee, Tzu Nien, Wong, Jason, Ma, Mike, Tseng, Tzyy-Jang
Published in 2021 IEEE CPMT Symposium Japan (ICSJ) (10.11.2021)

by CHEN TSUNG YUAN, TSENG TZYY JANG
Year of Publication 03.12.2013

by Yang, Channing Cheng-Lin, Lau, John H, Peng, Andy Yan-Jia, Teng, Vincent, Chen, Gary Chang-Fu, Huang, Jones Yu-Cheng, Chen, YH, Liu, Hsing-Ning, Tseng, Tzyy-Jang, Li, Ming
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)

by Lee, Tzu Nien, Lau, John H, Ko, Cheng-Ta, Xia, Tim, Lin, Eagle, Yang, Kai-Ming, Lin, Puru Bruce, Peng, Chia-Yu, Chang, Leo, Chen, Jia Shiang, Fang, Yi-Hsiu, Liao, Li-Yueh, Charn, Edward, Wang, Jason, Tseng, Tzyy-Jang
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)

by Lee, Tzu Nien, Lau, John H, Ko, Cheng-Ta, Xia, Tim, Lin, Eagle, Yang, Henry Kai-Ming, Lin, Puru Bruce, Peng, Tony Chia-Yu, Chang, Leo, Chen, Jia Shiang, Fang, Yi-Hsiu, Liao, Li-Yueh, Charn, Edward, Wang, Jason, Tseng, Tzyy-Jang
Published in 2021 IEEE CPMT Symposium Japan (ICSJ) (10.11.2021)

by HU DYI CHUNG, TSENG TZYY JANG
Year of Publication 08.05.2013

by Chou, Tzu-Chieh, Yang, Kai-Ming, Li, Jian-Chen, Yu, Ting-Yang, Chung, Ying-Ting, Ko, Cheng-Ta, Chen, Yu-Hua, Tseng, Tzyy-Jang, Chen, Kuan-Neng
Published in 2019 IEEE International Electron Devices Meeting (IEDM) (01.12.2019)