Utilization of low-melting temperature alloy with confined seal for reducing thermal contact resistance
Chu, Wen-Xiao, Tseng, Po-Hsiang, Wang, Chi-Chuan
Published in Applied thermal engineering (25.12.2019)
Published in Applied thermal engineering (25.12.2019)
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Journal Article
Magnetic-Free Radio Frequency Circulators Using Bulk Acoustic Wave Filters
Lin, Hsin-Han, Sung, Jung-Pang, Yu, Ming-Lun, Tseng, Po-Hsiang, Chen, Chun-Jen, Lu, Shih-Wen
Published in 2023 Asia-Pacific Microwave Conference (APMC) (05.12.2023)
Published in 2023 Asia-Pacific Microwave Conference (APMC) (05.12.2023)
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Conference Proceeding
Reconfigurable MAC Systolic Array Architecture Design for Three-Dimensional Convolution Neural Network
Lin, Shu-Yen, Lin, Kuan-Han, Tsai, Chun-Kuan, Tseng, Po-Hsiang
Published in 2020 IEEE International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan) (28.09.2020)
Published in 2020 IEEE International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan) (28.09.2020)
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Conference Proceeding
Electronic module
Lu, Shih-Wen, Yu, Ming-Lun, Tseng, Po-Hsiang, Chen, Chun-Jen, Lin, Hsin-Han
Year of Publication 16.01.2024
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Year of Publication 16.01.2024
Patent
ELECTRONIC MODULE
LIN, Hsin-Han, YU, Ming-Lun, CHEN, Chun-Jen, TSENG, Po-Hsiang, LU, Shih-Wen
Year of Publication 09.05.2024
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Year of Publication 09.05.2024
Patent
ELECTRONIC MODULE
LIN, Hsin-Han, YU, Ming-Lun, CHEN, Chun-Jen, TSENG, Po-Hsiang, LU, Shih-Wen
Year of Publication 23.02.2023
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Year of Publication 23.02.2023
Patent
Foldable electronic device
WU, CHUN-LIANG, LIAO, SHENG-YUEH, TSENG, PO-HSIANG, CHANG, LONGNG, HSU, CHIH-MING
Year of Publication 16.11.2022
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Year of Publication 16.11.2022
Patent
Foldable electronic device
WU, CHUN-LIANG, LIAO, SHENG-YUEH, TSENG, PO-HSIANG, CHANG, LONGNG, HSU, CHIH-MING
Year of Publication 11.05.2022
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Year of Publication 11.05.2022
Patent