SEMICONDUCTOR DEVICE WITH BUMP STRUCTURE AND METHOD OF MAKING SEMICONDUCTOR DEVICE
TSAI CHENG HUNG, TSAO PEI HAW, CHU LI HUAN, CHANG KUO CHIN, CHEN CHEN SHIEN
Year of Publication 03.11.2022
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Year of Publication 03.11.2022
Patent
SEMICONDUCTOR DEVICE WITH BUMP STRUCTURE AND METHOD OF MAKING SEMICONDUCTOR DEVICE
TSAI CHENG HUNG, TSAO PEI HAW, CHU LI HUAN, CHANG KUO CHIN, CHEN CHEN SHIEN
Year of Publication 04.08.2021
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Year of Publication 04.08.2021
Patent
Investigation of charge induced bond pad corrosion
Pei-Haw Tsao, Hung-Yu Chiu, Liao, H. C., Chen, K. C., Sung, M. C., Chen, Worth, Antai Xu
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
SEMICONDUCTOR DEVICE WITH BUMP STRUCTURE AND METHOD OF MAKING SEMICONDUCTOR DEVICE
TSAI CHENG HUNG, TSAO PEI HAW, CHU LI HUAN, CHANG KUO CHIN, CHEN CHEN SHIEN
Year of Publication 05.06.2019
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Year of Publication 05.06.2019
Patent
WLCSP Package and PCB Design for Board Level Reliability
Chiu, Jason, Chang, K.C., Hsu, Steven, Tsao, Pei-Haw, Lii, M.J.
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding
Low-K Flip Chip Board Level Reliability on 65nm Technology
Pei-Haw Tsao, Bill Kiang, Wu, K., Abel Chang, Tsomg-Dih Yuan
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding
Underfill characterization for low-k dielectric / Cu interconnect IC flip-chip package reliability
Pei-Haw Tsao, Chender Huang, Mirng-Ji Lii, Su, B., Nun-Sian Tsai
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
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Conference Proceeding
EDGE CRACK DETECTION SYSTEM
HSIAO HUANG TING, TSAI CHENG HUNG, XU AN TAI, LU NAI CHENG, TSAO PEI HAW, CHEN TSUI MEI
Year of Publication 08.12.2015
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Year of Publication 08.12.2015
Patent
Cavity-down thermal-enhanced package reliability evaluation for low-k dielectric/Cu interconnects IC
Pei-Haw Tsao, Chender Huang, Allan Lin, Mirng-Ji Lii, Perng, D.J., Nun-Sian Tsai
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
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Conference Proceeding