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Pei, Hao-Jan, Tsao, Chih-Chiang, Hsieh, Ching-Hua, Chung, Philip Yu-shuan, Chen, Cheng-Ting, Chang, Chia-Lun, Lin, Hsiu-Jen, Tsai, Yu-Peng, Kuo, Hsuan-Ting
Year of Publication 15.08.2024
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Year of Publication 15.08.2024
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Manufacturing method of package on package structure
Pei, Hao-Jan, Tsao, Chih-Chiang, Hsieh, Ching-Hua, Chen, Cheng-Ting, Chung, Philip Yu-Shuan, Chang, Chia-Lun, Lin, Hsiu-Jen, Tsai, Yu-Peng, Kuo, Hsuan-Ting
Year of Publication 28.05.2024
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Year of Publication 28.05.2024
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Package structure and manufacturing method thereof
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Year of Publication 28.11.2023
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Year of Publication 28.11.2023
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Package-on-package structure
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Year of Publication 20.12.2022
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Year of Publication 20.12.2022
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Bonding through multi-shot laser reflow
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Year of Publication 16.07.2024
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Year of Publication 16.07.2024
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BONDING THROUGH MULTI-SHOT LASER REFLOW
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Year of Publication 11.07.2024
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Year of Publication 11.07.2024
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Package-on-package structure
Cheng, Ming-Da, Ang, Ai-Tee, Huang, Hui-Min, Lin, Chih-Wei, Tsai, Yu-Peng, Liu, Chung-Shi
Year of Publication 01.02.2022
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Year of Publication 01.02.2022
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PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Chen, Wei-Yu, Huang, Yu-Chih, Tsao, Chih-Chiang, Hsieh, Ching-Hua, Cheng, Chia-Shen, Lin, Hsiu-Jen, Tsai, Yu-Peng, Yu, Jen-Jui, Chen, Chih-Hua
Year of Publication 17.11.2022
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Year of Publication 17.11.2022
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MANUFACTURING METHOD OF PACKAGE ON PACKAGE STRUCTURE
Pei, Hao-Jan, Tsao, Chih-Chiang, Hsieh, Ching-Hua, Chung, Philip Yu-shuan, Chen, Cheng-Ting, Chang, Chia-Lun, Lin, Hsiu-Jen, Tsai, Yu-Peng, Kuo, Hsuan-Ting
Year of Publication 11.08.2022
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Year of Publication 11.08.2022
Patent
Manufacturing method of package on package structure
Pei, Hao-Jan, Tsao, Chih-Chiang, Hsieh, Ching-Hua, Chen, Cheng-Ting, Chung, Philip Yu-Shuan, Chang, Chia-Lun, Lin, Hsiu-Jen, Tsai, Yu-Peng, Kuo, Hsuan-Ting
Year of Publication 24.05.2022
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Year of Publication 24.05.2022
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Bonding Through Multi-Shot Laser Reflow
Pei, Hao-Jan, Chen, Wei-Yu, Yu, Chen-Hua, Hsieh, Ching-Hua, Cheng, Chia-Shen, Chung, Philip Yu-Shuan, Huang, Kuei-Wei, Tsai, Yu-Peng, Lin, Hsiu-Jen, Liu, Chung-Shi
Year of Publication 17.11.2022
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Year of Publication 17.11.2022
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Bonding through multi-shot laser reflow
Pei, Hao-Jan, Chen, Wei-Yu, Yu, Chen-Hua, Hsieh, Ching-Hua, Cheng, Chia-Shen, Chung, Philip Yu-Shuan, Huang, Kuei-Wei, Tsai, Yu-Peng, Lin, Hsiu-Jen, Liu, Chung-Shi
Year of Publication 04.10.2022
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Year of Publication 04.10.2022
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Package-on-Package Structure
Cheng, Ming-Da, Ang, Ai-Tee, Huang, Hui-Min, Lin, Chih-Wei, Tsai, Yu-Peng, Liu, Chung-Shi
Year of Publication 05.11.2020
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Year of Publication 05.11.2020
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Method of processing solder bump by vacuum annealing
Cheng, Ming-Da, Lin, Chung-Cheng, Chen, Cheng-Ting, Lin, Hsiu-Jen, Tsai, Yu-Peng, Liu, Chung-Shi
Year of Publication 22.09.2020
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Year of Publication 22.09.2020
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Package-on-Package Structure
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Year of Publication 30.07.2020
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Year of Publication 30.07.2020
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Package on-package structure
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Year of Publication 14.04.2020
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Year of Publication 14.04.2020
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MANUFACTURING METHOD OF PACKAGE ON PACKAGE STRUCTURE
Pei, Hao-Jan, Tsao, Chih-Chiang, Hsieh, Ching-Hua, Chen, Cheng-Ting, Chung, Philip Yu-Shuan, Chang, Chia-Lun, Lin, Hsiu-Jen, Tsai, Yu-Peng, Kuo, Hsuan-Ting
Year of Publication 14.05.2020
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Year of Publication 14.05.2020
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Bonding Through Multi-Shot Laser Reflow
Pei, Hao-Jan, Chen, Wei-Yu, Yu, Chen-Hua, Hsieh, Ching-Hua, Cheng, Chia-Shen, Chung, Philip Yu-Shuan, Huang, Kuei-Wei, Tsai, Yu-Peng, Lin, Hsiu-Jen, Liu, Chung-Shi
Year of Publication 14.01.2021
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Year of Publication 14.01.2021
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Manufacturing method of package on package structure
Pei, Hao-Jan, Tsao, Chih-Chiang, Hsieh, Ching-Hua, Chung, Philip Yu-shuan, Chen, Cheng-Ting, Chang, Chia-Lun, Lin, Hsiu-Jen, Tsai, Yu-Peng, Kuo, Hsuan-Ting
Year of Publication 14.01.2020
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Year of Publication 14.01.2020
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