On “A new quantum blind signature with unlinkability”
Luo, Yi-Ping, Tsai, Shang-Lun, Hwang, Tzonelih, Kao, Shih-Hung
Published in Quantum information processing (01.04.2017)
Published in Quantum information processing (01.04.2017)
Get full text
Journal Article
Disrupting Image-Translation-Based DeepFake Algorithms with Adversarial Attacks
Yeh, Chin-Yuan, Chen, Hsi-Wen, Tsai, Shang-Lun, Wang, Shang-De
Published in 2020 IEEE Winter Applications of Computer Vision Workshops (WACVW) (01.03.2020)
Published in 2020 IEEE Winter Applications of Computer Vision Workshops (WACVW) (01.03.2020)
Get full text
Conference Proceeding
MULTI-BUMP CONNECTION TO INTERCONNECT STRUCTURE AND MANUFACTURING METHOD THEREOF
TSAI SHANG LUN, LEE TSUNG YEN, LIN PO YAO, HSU CHIA KUEI, YEW MING CHIH
Year of Publication 09.05.2022
Get full text
Year of Publication 09.05.2022
Patent
Multi-Bump Connection to Interconnect Structure and Manufacturing Method Thereof
Hsu, Chia-Kuei, Lee, Tsung-Yen, Tsai, Shang-Lun, Yew, Ming-Chih, Lin, Po-Yao
Year of Publication 05.10.2023
Get full text
Year of Publication 05.10.2023
Patent
Multi-bump connection to interconnect structure and manufacturing method thereof
Hsu, Chia-Kuei, Lee, Tsung-Yen, Tsai, Shang-Lun, Yew, Ming-Chih, Lin, Po-Yao
Year of Publication 18.07.2023
Get full text
Year of Publication 18.07.2023
Patent
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
CHEN, Shuo-Mao, TU, Yen-Chu, LIU, Monsen, TSAI, Shang-Lun, JENG, Shin-Puu
Year of Publication 18.05.2023
Get full text
Year of Publication 18.05.2023
Patent
HYBRID ORGANIC AND NON-ORGANIC INTERPOSER WITH EMBEDDED COMPONENT AND METHODS FOR FORMING THE SAME
CHEN, Shuo-Mao, LAI, Po-Ying, LIU, Monsen, TSAI, Shang-Lun, JENG, Shin-Puu
Year of Publication 02.03.2023
Get full text
Year of Publication 02.03.2023
Patent
INTEGRATED PASSIVE DEVICE DIES AND METHODS OF FORMING AND PLACEMENT OF THE SAME
Liu, Monsen, Tsai, Shang-Lun, Chen, Shuo-Mao, Lai, Po-Ying, Jeng, Shin-Puu
Year of Publication 29.12.2022
Get full text
Year of Publication 29.12.2022
Patent
INTERPOSER VIA INTERCONNECT SHAPES WITH IMPROVED PERFORMANCE CHARACTERISTICS AND METHODS OF FORMING THE SAME
Liu, Monsen, Tsai, Shang-Lun, Chen, Shuo-Mao, Lai, Po-Ying, Jeng, Shin-Puu
Year of Publication 22.12.2022
Get full text
Year of Publication 22.12.2022
Patent
Multi-Bump Connection to Interconnect Structure and Manufacturing Method Thereof
Hsu, Chia-Kuei, Lee, Tsung-Yen, Tsai, Shang-Lun, Yew, Ming-Chih, Lin, Po-Yao
Year of Publication 05.05.2022
Get full text
Year of Publication 05.05.2022
Patent
Semiconductor structure and method of forming the same
TSAI, SHANG-LUN, LIN, PO-YAO, LEE, TSUNG-YEN, HSU, CHIA-KUEI, YEW, MINGIH
Year of Publication 11.08.2023
Get full text
Year of Publication 11.08.2023
Patent
Semiconductor package structure
CHEN, SHUO-MAO, JENG, SHIN-PUU, TSAI, SHANG-LUN, TU, YENU, LIU, MONSEN MENG-SHENG
Year of Publication 01.06.2023
Get full text
Year of Publication 01.06.2023
Patent
MEHRHÖCKERVERBINDUNG ZU EINER INTERCONNECT-STRUKTUR UND VERFAHREN ZU IHRER HERSTELLUNG
Hsu, Chia-Kuei, Lee, Tsung-Yen, Tsai, Shang-Lun, Yew, Ming-Chih, Lin, Po-Yao
Year of Publication 05.05.2022
Get full text
Year of Publication 05.05.2022
Patent