New 3-D Chip Stacking Architectures by Wire-On-Bump and Bump-On-Flex
Baik-Woo Lee, Jui-Yun Tsai, Hotae Jin, Yoon, C.K., Tummala, R.R.
Published in IEEE transactions on advanced packaging (01.05.2008)
Published in IEEE transactions on advanced packaging (01.05.2008)
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Journal Article
Novel Ceramic Composite Substrates for High-Density and High Reliability Packaging
Kumbhat, N., Raj, P.M., Pucha, R.V., Jui-Yun Tsai, Atmur, S., Bongio, E., Sitaraman, S.K., Tummala, R.R.
Published in IEEE transactions on advanced packaging (01.11.2007)
Published in IEEE transactions on advanced packaging (01.11.2007)
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Journal Article
New 3D chip stacking SIP technology by wire-on-bump (WOB) and bump-on-flex (BOF)
Baik-Woo Lee, Jui-Yun Tsai, Hotae Jin, Yoon, C.K., Tummala, R.R.
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding
MiniZero: Comparative Analysis of AlphaZero and MuZero on Go, Othello, and Atari Games
Wu, Ti-Rong, Guei, Hung, Peng, Pei-Chiun, Huang, Po-Wei, Wei, Ting Han, Shih, Chung-Chin, Tsai, Yun-Jui
Year of Publication 17.10.2023
Year of Publication 17.10.2023
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Journal Article
A novel 20-100/spl mu/m pitch IC-to-package interconnect and assembly process for Pb-free solder, copper or gold stud bumps
Jui-Yun Tsai, Sundaram, V., Wiedenman, B., Yangyang Sun, Wong, C.P., Tummala, R.
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding