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"TSAI, HUNGI"
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SEMICONDUCTOR DEVICE WITH CONDUCTIVE CAP LAYER OVER CONDUCTIVE PLUG AND METHOD FOR FORMING THE SAME
by
TSAI
,
HUNGI
Year of Publication
14.03.2024
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SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
by
TSAI
,
HUNGI
Year of Publication
15.02.2024
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SEMICONDUCTOR DEVICE WITH CONDUCTIVE CAP LAYER OVER CONDUCTIVE PLUG AND METHOD FOR PREPARINGING THE SAME
by
TSAI
,
HUNGI
Year of Publication
14.12.2023
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SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
by
TSAI
,
HUNGI
Year of Publication
02.11.2023
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SEMICONDUCTOR DEVICE WITH PROGRAMMABLE ELEMENT AND METHOD FOR FABRICATING THE SAME
by
TSAI
,
HUNGI
Year of Publication
21.09.2023
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METHOD FOR PREPARING SEMICONDUCTOR DEVICE STRUCTURE WITH BOTTOM CAPACITOR ELECTRODE HAVING CROWN-SHAPED STRUCTURE AND INTERCONNECT PORTION
by
TSAI
,
HUNGI
Year of Publication
22.06.2023
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SEMICONDUCTOR DEVICE STRUCTURE WITH BOTTOM CAPACITOR ELECTRODE HAVING CROWN-SHAPED STRUCTURE AND INTERCONNECT PORTION AND METHOD FOR FORMING THE SAME
by
TSAI
,
HUNGI
Year of Publication
30.06.2022
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METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH POROUS DIELECTRIC STRUCTURE
by
TSAI
,
HUNGI
Year of Publication
24.02.2022
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INTEGRATED CIRCUIT STRUCTURE
by
TSAI
,
HUNGI
Year of Publication
24.02.2022
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METHOD FOR FORMING A SEMICONDUCTOR DEVICE WITH CONDUCTIVE CAP LAYER OVER CONDUCTIVE PLUG
by
TSAI
,
HUNGI
Year of Publication
26.08.2021
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SEMICONDUCTOR DEVICE WITH POROUS DIELECTRIC STRUCTURE AND METHOD FOR FABRICATING THE SAME
by
TSAI
,
HUNGI
Year of Publication
29.07.2021
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SEMICONDUCTOR DEVICE WITH CONDUCTIVE CAP LAYER OVER CONDUCTIVE PLUG AND METHOD FOR FORMING THE SAME
by
TSAI
,
HUNGI
Year of Publication
26.11.2020
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Semiconductor device with programmable element and method for fabricating the same
by
TSAI
,
HUNGI
Year of Publication
21.02.2024
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Semiconductor device with programmable element and method for fabricating the same
by
TSAI
,
HUNGI
Year of Publication
01.10.2023
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Method for forming semiconductor device structure with bottom capacitor electrode having crown-shaped structure and interconnect portion
by
TSAI
,
HUNGI
Year of Publication
21.07.2023
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Integrated circuit structure and method for preparing the same
by
TSAI
,
HUNGI
Year of Publication
01.10.2022
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Semiconductor device structure with bottom capacitor electrode having crown-shaped structure and interconnect portion and method for forming the same
by
TSAI
,
HUNGI
Year of Publication
01.07.2022
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Semiconductor device with porous dielectric structure and method for fabricating the same
by
TSAI
,
HUNGI
Year of Publication
01.03.2022
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Integrated circuit structure and method for preparing the same
by
TSAI
,
HUNGI
Year of Publication
01.02.2022
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Semiconductor device with porous dielectric structure and method for fabricating the same
by
TSAI
,
HUNGI
Year of Publication
01.08.2021
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